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Nor Flash

This document provides a code to identify NOR flash memory chips. It includes information about the memory size, organization, voltage requirements, generation, package type and other specifications. Each column in the code table represents a different specification that is used to uniquely identify each NOR flash chip model.

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100 views

Nor Flash

This document provides a code to identify NOR flash memory chips. It includes information about the memory size, organization, voltage requirements, generation, package type and other specifications. Each column in the code table represents a different specification that is used to uniquely identify each NOR flash chip model.

Uploaded by

sachin
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 5

NOR-Flash Code Information(1/5)

Last Updated : August 2009

K8XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

1. Memory (K) - De-Multiplexed Burst


12 : 512, 16Bank
2. NOR Flash : 8 26 : 128M, 8M / 16Bank / 66)
27 : 128M, 8M / 16Bank / 77)
3. Small Classification 28 : 128M, 8M / 16Bank
5 : Dual Bank Die Stack 29 : 128M, 8M / 16Bank / 88)
6 : Single Bank Die Stack 30 : 32M, 2M / 16Bank / 66)
7 : Multiplexed DDP 31 : 32M, 2M / 16Bank / 77)
8 : De-Multiplexed DDP 32 : 32M, 2M / 16Bank
A : De-Multiplexed Burst 33 : 32M, 2M / 16Bank / 88)
B : Single Bank Boot Block 56 : 256M, 16Bank
C : MLC De-Muxed 62 : 64M , 4M / 16Bank / 66)
D : Dual Bank Boot Block 63 : 64M, 4M / 16Bank / 77)
E : ECC Muxed 64 : 64M, 4M / 16Bank
F : MLC Muxed 65 : 64M, 4M / 16Bank / 88)
G : MLC De-Multiplexed DDP
H : MLC Multiplexed DDP - Single Bank Boot Block
J : Flex-NOR, Muxed 16 : 16M 27 : 128M, 2CS
K : Flex-NOR, Demuxed 28 : 128M 32 : 32M
M : ECC Demuxed 64 : 64M 80 : 8M
P : Page Mode
Q : Page Mode DDP - MLC De-Muxed
S : Multiplexed Burst 10 : 512M, 16Bank / 33) 11 : 512M, 16Bank / 44)
U : Single Bank Uniform Block 12 : 512M, 16Bank / 11) 13 : 512M, 16Bank / 22)
54 : 256M, 16Bank / 33) 55 : 256M, 16Bank / 44)
4~5. Density 56 : 256M, 16Bank / 11) 57 : 256M, 16Bank / 22)
- Dual Bank Die Stack 1G : 1G, 16Bank
64 : 64M, 3232 / 824 65 : 64M, 3232 / 1616
- Dual Bank Boot Block (Bank1, Bank2)
- Single Bank Die Stack 15 : 16M, 2M / 14M 16 : 16M, 4M / 12M
27 : 128M, 2CS 64 : 64M, 32M / 32M 17 : 16M, 8M / 8M 32 : 32M, 8M / 24M
33 : 32M, 16M / 16M 62 : 64M, 8M / 56M
- Multiplexed DDP 63 : 64M, 16M / 48M 64 : 64M, 24M / 40M
11 : 512M, 1CS / 32Bank 13 : 512M, 2CS 65 : 64M, 32M / 32M
56 : 256M, 16Bank 1G : 1G, 16Bank
Notes
- De-Multiplexed DDP 1) Frequency : 66/83 MHz
12 : 512M, 16Bank 13 : 512M, 2CS 2) Frequency : 108/133 MHz
56 : 256M, 16Bank 1G : 1G, 16Bank 3) Frequency : 66/83 MHz, MRS Sync Burst
4) Frequency : 108/133 MHz, MRS Sync Burst
5) Frequency : 54 MHz
6) MRS Sync burst only
7) Enhanced block protection only
8) MRS Sync burst & Enhanced block protection
* CS : Chip Select

-1- Part Number Decoder


NOR-Flash Code Information(2/5)
Last Updated : August 2009

K8XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

- MLC Muxed - Page Mode


10 : 512M, 16Bank / 33) 11 : 512M, 16Bank / 44) 16 : 16M, 4Bank 17 : 16M, 8Bank
12 : 512M, 16Bank / 11) 13 : 512M, 16Bank / 22) 27 : 128M, 1Bank 28 : 128M, 4Bank
54 : 256M, 6Bank / 33) 55 : 256M, 16Bank / 44) 29 : 128M, 2CS / 4Bank 32 : 32M, 4Bank
56 : 256M, 16Bank / 11) 57 : 256M, 16Bank / 22) 33 : 32M, 8Bank 55 : 256M, 1Bank
1G : 1G, 16Bank 56 : 256M, 4Bank 64 : 64M, 4Bank
65 : 64M, 8Bank
- MLC De-Multiplexed DDP
11 : 512M, 1CS / 32Bank / 11) - Page Mode DDP
12 : 512M, 1CS / 32Bank / 22) 11 : 512M 12 : 512M, 8Bank
13 : 512M, 2CS / 11) 14 : 512M, 2CS / 22) 28 : 128M, 8Bank

- MLC Multiplexed DDP - Multiplexed Burst


11 : 512M, 1CS / 32Bank / 11) 10 : 512M, 16Bank / 3 11 : 512M, 16Bank / 4
12 : 512M, 1CS / 32Bank / 22) 12 : 512M, 16Bank / 1 13 : 512M 16Bank / 2
13 : 512M, 2CS / 11) 26 : 128M, 8M / 16Bank / 6
14 : 512M, 2CS / 22) 27 : 128M, 8M / 16Bank / 7 28 : 128M, 8M / 16bank
29 : 128M, 8M / 16Bank / 8
- Flex-NOR Muxed 30 : 32M, 2M / 16Bank / 6
11 : 512M, 8Bank / 55) 12 : 512M, 8Bank / 11) 31 : 32M, 2M / 16Bank / 7 32 : 32M, 16Bank
13 : 512M, 8ank / 22) 55 : 256M, 8Bank / 55) 33 : 32M, 2M / 16Bank / 8 56 : 256M, 16Bank
56 : 256M, 8Bank / 11) 57 : 256M, 8Bnks / 22) 62 : 64M, 4M / 16Bank / 6
1F : 1G, 8Bank / 55) 1G : 1G, 8Bank / 11) 63 : 64M, 4M / 16Bank / 7 64 : 64M, 4M / 16Bank
1H : 1G, 8Bank / 22) 65 : 64M, 4M / 16Bank / 8 66 : 64M, 8Bank / 6
67 : 64M, 8Bank / 7 68 : 64M, 8Bank
- Flex-NOR Demuxed 69 : 64M, 8Bank / 8
11 : 512M, 8Bank / 55) 12 : 512M, 8Bank / 11)
13 : 512M, 8Bank / 22) 55 : 256M, 8Bank / 55) - Single Bank Uniform Block
56 : 256M, 8Bank / 11) 57 : 256M, 8Bank / 22) 16 : 16M 27 : 128M, 2CS 28 : 128M
1F : 1G, 8Bank / 55) 1G : 1G, 8Bank / 11) 32 : 32M 64 : 64M 80 : 8M
1H : 1G, 8Bank / 22)
- ECC Muxed
Notes 12 : 512M, 16Bank/1 13 : 512M, 16Bank/2
1) Frequency : 66/83 MHz
2) Frequency : 108/133 MHz 6~7. Organization
3) Frequency : 66/83 MHz, MRS Sync Burst 08 : x8 15 : x16
4) Frequency : 108/133 MHz, MRS Sync Burst 16 : x8 / x16 32 : x16 / x32
5) Frequency : 54 MHz
6) MRS Sync burst only
7) Enhanced block protection only
8) MRS Sync burst & Enhanced block protection

* CS : Chip Select

-2- Part Number Decoder


NOR-Flash Code Information(3/5)
Last Updated : August 2009

K8XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

8. Vcc 10. Generation


8 : 1.8V (1.7~1.9V) E : 1.8V (1.7V~1.95V) M : 1st Generation A : 2nd Generation
F : 1.8V / Vio3.0V (2.2~3.3V) B : 3rd Generation C : 4th Generation
K : 2.8V (2.5V~3.1V) L : 1.8V (1.65V~1.95V) D : 5th Generation E : 6th Generation
R : 2.0V (1.8V~2.2V) S : 2.5V (2.3V~2.7V) F : 7th Generation
U : 3.0V / 3.3V (2.7V~3.6V) V : 3.0V (2.7~3.1V)
Y : 3.0V (2.7V~3.3V) 11. "─“

9. Device Type
1 : 4M SRAM MCP 12. Package
2 : 8M SRAM MCP 1 : MCP C : CHIP BIZ
3 : 16M SRAM MCP D : FBGA (Lead-Free)
4 : 128M SDR H-Die MCP E : FBGA (Lead-Free, 1.0mm pitch)
5 : 16M UtRAM MCP F : FBGA
6 : 32M UtRAM MCP G : FBGA (Lead-Free, Halogen-Free)
7 : 128M DDR MCP H : FBGA (Lead-Free, OSP, Halogen-Free)
8 : OneNAND, SDRAM MCP L : TBGA (Lead-Free)
9 : 128M MDD P : TSOP1 (Lead-Free)
A : 8M Boot Block MCP (Top) Q : TSOP1 (Lead-Free, Halogen-Free)
B : Bottom Boot Block S : FBGA (Lead-Free, OSP)
C : BootBlock (Chip1-bot, Chip-2-top) U : FBGA (OSP) Y : TSOP1
D : 16M UtRAM MCP_Rev W : WAFER
E : 128M MDD_Rev
F : 16M Dual Bank MCP (Top) 13. Temp
G : 16M Dual Bank MCP (Bottom) 0 : NONE C : Commercial
H : 32M Dual Bank MCP (Top) E : Extended I : Industrial
I : 32M Dual Bankxxxx MCP (Bottom)
J : 64M Dual Bank MCP (Top)
K : 64M Dual Bank MCP (Bottom)
L : 4M Boot Block MCP (Top)
M : Top Boot Block in DDP
N : Bottom Boot Block in DDP
P : 256M DDR MCP
Q : Top and Bottom Boot Block
R : Uniq ID (Top Boot Block)
S : Uniq ID (Bottom Boot Block)
T : Top Boot Block
U : Uniform Block (New Process)
V : Uniform Block, Low Block Protection
W : 128M UtRAM MCP
Y : 64M UtRAM MCP
Z : Uniform Block

-3- Part Number Decoder


NOR-Flash Code Information(4/5)
Last Updated : August 2009

K8XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

14~15. Speed
03 : 85ns 07 : 70ns
08 : 80ns 09 : 90ns
12 : 120ns
1A : 100ns (C/F 40MHz)
1B : 100ns (C/F 54MHz)
1C : 100ns (C/F 66MHz)
1D : 100ns (C/F 83MHz)
1E : 100ns (C/F 108MHz)
1F : 100ns (C/F 133MHz)
2A : 70ns/20ns (Page)
2B : 80ns/25ns (Page)
2C : 90ns/30ns (Page)
2D : 85ns/25ns (Page)
4A : 55ns/20ns (Page)
4B : 60ns/25ns (Page)
4C : 65ns/25ns (Page)
4D : 70ns/30ns (Page)
4E : 80ns/30ns (Page)
5A : 96ns (J/K 54MHz)
5B : 96ns (J/K 66MHz)
5C : 96ns (J/K 83MHz)
5D : 96ns (J/K 108MHz)
5E : 96ns (J/K 133MHz)
6F : 66ns (C/F 133MHz)
7A : 70ns (C/F 75MHz)
7B : 88.5ns (C/F 54MHz)
7C : 70ns (C/F 66MHz)
7D : 70ns (C/F 80MHz)
7E : 70ns (C/F 108MHz)
9A : 90ns (C/F 40MHz)
9B : 95ns (C/F 66MHz)
9C : 90ns (C/F 54MHz)
9D : 90ns (C/F 80MHz)
DS : Daisychain Sample
00 : NONE (Containing Exception handling code)

-4- Part Number Decoder


NOR-Flash Code Information(5/5)
Last Updated : August 2009

K8XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

16. Packing Type


- Common to all products, except of Mask ROM
- Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately)

Divide Packing Type New Marking


TAPE & REEL T
Component Other ( Tray, Tube, Jar ) 0 ( Number)
Stack S
MODULE TAPE & REEL P
Module
MODULE Other Packing M

17~18. Customer "Customer List Reference"

-5- Part Number Decoder

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