0% found this document useful (0 votes)
156 viewsBusduct
Bus duct criteria
Uploaded by
Hari HaranCopyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF or read online on Scribd
0% found this document useful (0 votes)
156 viewsBusduct
Bus duct criteria
Uploaded by
Hari HaranCopyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF or read online on Scribd
/ 15
DESIGN OF MEDIUM VOLTAGE
Prepared by
A.Srinivasan,B.E.,
SREE SWITCHGEARS & CONTROLS.
COIMBATORE.«
Peddilddd tdi ddd ddd dd dd
|
A oh AR RR teeter meme gargs sant ane
=
I thank all the members of ‘Electrical
Installation Engineers Welfare Association’
having given me an opportunity to share the
technical knowledge as I know to some extend
thro’ this write up on Medium Voltage Busbar &
Busduct Design. 1 hope this will be useful to the
Practising Engineers & Contractors. I hope that I
have covered all the area pertaining to Busbar
Design. If at all any particulars left out or wrongly
specified please feel free to inform me for further
correction, deletion & addition.
Regards
A.SRINIVASAN
Prete tee eee
a aet
t
MEDIUM VOLTAGE BUSDUCT DESIGN
In ‘ion :
Busbar is a device to receive the total power from
the source & distribute to various circuits connected
to that. It consists of solid Electrical conducting
material such as Aluminium or Copper. Normally in
M.V. installation the busbars made out of Aluminium /
Copper sections fixed on the insulators enclosed in
;
}
}
i
:
i
non magnetic or magnetic enclosures.
While transmitting higher current in M.V.Installation
we have to provide number of L.T.Cables. Wherein
connecting the same to Transformer / Generator
Terminals and switch boards is a cumbersome work.
To avoid this solid Copper / Aluminium bars are used
in an enclosure.
The performance of busbar in the enclosure for
indoor / outdoor use is subject to following
parameters.
1) Conductivity of materials used.
2) Temperature rise during full load current & short
circuit.
She eee 6 beeen eee eeedaee a,
SEEIES ESE IIE EIIIE IV IEE?Pbdd ES ddd bdbddddddd ddddd ld ld lll lle
|
3) Power losses & voltage Drop
4) Forces acting on busbar during short circuit &
withstanding capacity.
5) Altitude above mean sea level where we are
using.
6) Skin Effect & Proximity effect
7) Painting of busbars.
While designing the Busbar / Busduct we have to
take into account the above and suitable derating
factors should be applied and adequacy of Electrical
& Mechanical features verified.
Now we can discuss the above in details
re oaths tn ee Aetna eae
FreeeUSES II EIS o db ddd db d Ji IIIT LEE
Se
Jeera ena a ear ae a REE A RR AE te AAR A
1) Temperature Rise :
1) The operating temperature rise of busbar must be
imited to a level at which there should not be
a) Long term deterioration of the conductor, joints or the
equipments connected to bus.
b) A reduction
Mechanical strength of busbar.
2) In Normal practice the temperature rise must not
exceed 50°C on an ambient having a peak value of
40°C & average value of 35°C. Hence the total
temperature should not exceed 85°C. The ambient
temperature given here is not atmospheric
temperature. It Is the temperature surrounding
busbar.
3) The busbar material may be either Copper or
Aluminium. Hence the busbar carrying the same
current must dissipate the same amount of heat per
unit surface area for equal Temperature Rise.
AE EE HR
dicted cele ed eddie led de te ede tee©
‘
I
i
}
;
‘
{
;
‘
‘
i
;
;
é
i
i
‘
i
i
i
;
:
;
;
;
i
‘
é
‘
i
;
i
i
i
;
;
i
t
a
4) To have the same Temperature Rise for the same
current in Aluminium bar compared to Copper bar
following measures should be taken case.
a) The thickness of Aluminium bar should be increased
50% of Copper thickness. Example : Cu.100x6mm.,
Al: 100 x 9mm. In this case weight ratio will be 2.9
b) Alternatively increase the width of Al. by 25% of width
of copper.In this case weight Ratio will be 2.63.
5) Ratio of Cross sectional Area of busbar to Enclosure
Area plays a major role in limiting the Temperature
e. The deratign#factor is to be applied as per the
tabulation enclosed (Annexure ~ II)
2) Voltage Drop
1) This is mainly due to Reactance which can be
minimized by making the busbar spacing small.
2) In multiple runs of busbar / phase if close spacing is
provided between the busbar without
Proximity effect will araise which will increase the
resistive voltage Drop & corresponding Losses.
bn ane hannah eae ete geen hte Ate te ana eet th ana
eee ee.
ddbdddddddddd du
SEITE TIS EI Sd
ag
2 ¢
FAP EAL ALAA ATE
3) Moreover the effect of reducing space will increase the
Electro-magnetic force on busbar for a given fault
current.
4) This must be countered by providing stronger or closer
supports:
5) Larger spacing will save the cost of supports
i
6) The ideal spacing between busbars of same phase
should be thickness of bar used.
For a 415V busbar the min. clearance should be
a) To earth in air 19mm (Open)
16mm (Enclosed)
b) Between Pharas in
25mm (Open)
19mm (Enclosed)
3) Alti
The busbar intended for use at high altitude is tested
near Sea Level, the limit of temperature rise should be
reduced by 1% for each 300mts. excess of 1000
Mtrs. above sea level at which busbar is to be
installed. The correction factor should be applied as
per the table given in the Annexure-III-A.
goes than a
siete ste
dec tech deleted tenet e-t-testetelteteteete teetePYveeseeVveseveeyvusevuvvuuvseeueunvvuVvVdv Ve suger
pep eeeace eases ne cccecrecetoecasseaseeescuseereecest
4) Forces acting on Busbar +
a) Weight
b) Expansion Force
c) Electromagnetic Force
1) Expansion joints should be provided at the interval of
every 5Mtrs. and the ends of connecting equipments
to arrest the longitudinal force which will stress the
material & damage the insulators due to short circuit
forces.
2) Electromagnetic force which is larger than all forces
running perhaps to 100 Kgm? / Mtr. run or even more
under the mostsevere short circuit conditions.
3) Electromagnetic force will act in the same direction as
the weight.
4) Hence it is suggested to have a support at every
500mm & Provide the busbar arrangement invertical
position to avoid heavy damage during short circuit.
5) If 2 or more runs of Busbars are provided spacer
equivalent to Bus thickness should be provided at
every 500mm interval.
é
Jie ae eet ere ete te Et ah ah REE A}
Ii
Ye A RT Rt At tt aan
5) Current Distribution & Inductive Effects :
1) A.C. Current Distribution is controlled by Inductive
effect as well as by Resistance.
‘e
i
i
i
;
i
¢
2) Hence the current density varies over the section in
magnitude & phase based on the magnetic flux
produced in the base.
3) The inductive effect due to the current in the
conductor itself is known as SKIN EFFECT which
results higher Uniform current density in the outer
section of the conductor.
;
i
i
i
&
*
:
I
conductor varies depends on the SKIN DEPTH i;
character of material i
5) The Current density may be distorted by the current in i
adjacent conductors. This effect is called PROXIMITY i
EFFECT. :
6) Due to Proximity effect the Current density of the i
outer surface of the conductors facing each other will t
}
i
:
i
:
{
a
¢
4
‘
4
;
‘
‘
i
}
'
t
t
:
‘
‘
;
} 4) The current density on the outer section of the
i
t
4
‘
}
}
;
;
e
é
‘
‘
‘
i. be reduced.
4
;
:
i
‘
IEE IIS IIIS IS LI IIE EEE IF I IE ISSA T
=,
» 4Jee ET EL RT ew
Joining of Busbar :
1) The joining of busbars may be done by two methods
as normal practice.
1) Over lapping each other
