CQI-17

Special Process: Electronic Assembly Manufacturing-

Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Special Process: Electronic Assembly Manufacturing-Soldering System Assessment (EAM-SSA)

Facility Name:

Address:

Phone Number: Fax Number:

Number of Assembly, Soldering, Testing Employees at Captive Assembly, Soldering, Testing Organization
Commercial Assembly, Soldering, Testing Organization (Y/N)
this Facility: (Y/N)

Date of Assessment: Date of Previous Assessment:

Type(s) of Soldering at this Facility (Check all that Apply):

Process Table A: Process Table F: Process Table K:

- Solder Paste Printing + SPI Inspection - Robotic Soldering - Conformal Coating
- Table A-1 Process Parameters - Table F-1 Manual Soldering - Table K-1 Process Parameters

Process Table B: Process Table G: Process Table L:

- Surface Mount Component Placement - SMT - Laser/Soft Beam Soldering - PCA Separation
- Table B-1 Process Parameters - Table G-1 Process Parameters - Table L-1 Process Parameters

Process Table C:
Process Table H: Process Table M:
- Reflow Oven + AOI/AXI Inspection
- Induction Soldering - In-Circuit Test
- Table C-1 Process Parameters

Process Table D: Process Table I:

Process Table N:
- Adhesive Dispensing - Component Fixation - Press Fit Insertion
- Functional Test
and Mechanical Support - Table I-1 Process Parameters

Process Table E:
Process Table J:
- Wave/Selective Soldering + AXI/Manual Visual Process Table O:
- Cleaning/Contamination Control
Inspection - Rework, Repair, Touch-up
- Table J-1 Process Parameters
- Table E-1 Process Parameters

Current Quality Certification(s)

Date of Re-assessment (if necessary):

Personnel Contacted:
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Name: Title: Phone: Email:

Auditors/Assessors
Name Company Phone: Email:

Number of "Not Satisfactory" Findings from Section 1 - Section 3:

Number of "Needs Immediate Action" Findings from Section 1 - Section 3:

Number of "Fail" Findings in the Job Audit(s):

Number of "Not Satisfactory" Findings from Process Table(s):

Number of "Needs Immediate Action" Findings from Process Table(s):

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Special Process: Electronic Assembly Manufacturing - Soldering Systems Assessment (General Facility Overview)

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Needs
Question Not
Question Requirements and Guidance Objective Evidence N/A Satisfactory Immediate
Number Satisfactory
Action

Section 1 - Management Responsibility and Quality Planning

a. There shall be a dedicated and qualified assembly, manufacturing,
soldering expert on site.

b. This individual shall be a full-time employee and the position shall be

reflected in the organization chart.

Is there a dedicated and qualified c. A job description shall exist identifying the qualifications for the position
1.1 assembly, manufacturing, soldering including the Soldering and/or Chemistry knowledge.
and testing expert on-site?

d. The qualifications shall include a minimum of 5 year’s experience in

Electronic Assembly Manufacturing – Soldering, or applicable industry
standards (see Table 1-1 Industry Standards) or a combination of formal
metallurgical training and Electronic Assembly Manufacturing – Soldering
experience totaling a minimum of 5 years.

a. The organization shall incorporate a documented advance quality

planning procedure.

b. A feasibility study shall be performed and internally approved for each

part. Similar parts can be grouped into part families for this effort as defined
by the organization.
Does the assembly, manufacturing,
1.2 soldering and testing organization
c. After the part approval process is approved by the customer, no
perform advanced quality planning?
assembly, manufacturing, soldering and testing process changes are
allowed unless approved by the customer.

d. The soldering organization shall contact the customer when clarification

of process changes is required. This clarification of process changes shall
be documented.

a. The organization shall incorporate the use of a documented Failure

Mode and Effects Analysis (FMEA) procedure and ensure the FMEA's are
updated to reflect current part quality status.

b. The FMEA shall be written for each part or part family or they may be
Are assembly, manufacturing, process-specific and written for each process. In any case, they shall
soldering and testing FMEA's up to address all process steps from part receipt to part shipment and all key
1.3
date and reflecting current soldering process parameters as defined by the organization.
processing?
c. A cross-functional team shall be used in the development of the FMEA.

d. All special characteristics, as defined by the organization and its

customers, shall be identified, defined, and addressed in the FMEA.

a. The organization shall incorporate the use of a documented Control

Plan procedure and ensure the Control Plans are updated to reflect current
controls.

Are assembly, manufacturing,

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

b. The Control Plans shall be written for each part or part family or they
may be process-specific and written for each process. In any case, they
shall address all process steps from part receipt to part shipment and
identify all equipment used and all key solder process parameters as
defined by the organization.
Are assembly, manufacturing,
soldering and testing process Control c. A cross-functional team, including a production operator, shall be used
1.4
Plans up to date and reflecting in the development of Control Plans, which shall be consistent with all
current processing? associated documentation such as work instructions, shop travelers, and
FMEA's.

d. All special characteristics, as defined by the organization and its

customers, shall be identified, defined, and addressed in the Control Plans.

e. Sample sizes and frequencies for evaluation of process and product

characteristics shall also be addressed consistent with the minimum
requirements listed in the Process Tables and/or Control Plan.

a. The organization shall have a procedure and process to ensure the

timely review, distribution and implementation of all customer and industry
Are all assembly, manufacturing, engineering standards/specifications and changes based on customer-
soldering, testing related and required schedule.
referenced specifications, standards
current and available? For example: b. The organization shall have all related assembly, manufacturing,
1.5
IPC, SAE, AIAG, ASTM, General soldering and customer referenced standards and specifications available
Motors, Honda, Ford FEMR (Ford for use, like but not limited to SAE, AIAG, ASTM, ISO, EN, JIS, General
Electronic Manufacturing Motors, Ford, and Stellantis.
Requirement), Toyota and Stellantis.
c. The procedure shall include a 2-week distribution limit for cascading
newly received and reviewed documents.

a. The assembly, manufacturing, solder organization shall have written

process procedure or work instructions for all active processes and identify
all steps of the process including relevant operating parameters which are
included on the Process Parameter Tables, Process Tables, or Control
Is there a written process Procedure Plan, or equivalent document. Examples can be seen along Process
1.6 or Work Instructions to comply with Parameters Guideline Tables. Such parameters shall not only be defined,
1.5 for all active processes? they shall have operating tolerances as defined by the organization in order
to maintain process control.

b. Objective evidence of these written process procedures or work

instructions shall exist (i.e., job cards, computer-based recipes).

a. Process capability studies shall be completed at initial validation, after

relocation of any process equipment and after a major rebuild of any
equipment.

b. The organization and/or customer shall define what constitutes a major

rebuild.
Has a valid process capability study
been performed initially and after c. Initial process capability studies shall be conducted for all solder and
1.7
process equipment has been electronic assembly manufacturing processes. Shall be done per
relocated, or had a major rebuild? manufacturing line in accordance with customer requirements.

d. In the absence of customer requirements, the organization shall

establish acceptable ranges for process capability study.

e. An action plan shall exist to address capability studies that fall outside
customer requirements or established ranges.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

a. The organization shall have a system to collect, analyze, defect

prevention efforts, and react to product or process data over time (KPO)
Does the assembly, manufacturing,
soldering and testing organization b. The analysis of products and processes over time shall yield objective
1.8 collect and analyze data over time, evidence for defect prevention efforts.
and react to this data?
c. Analysis shall include ongoing trend or historical data of product or
process parameters. The analysis shall determine which key process
outputs (KPO) to include.

a. The key process outputs (KPO) includes thermal profiles, SPC, set-up
How the qualified personnel (i.e., sheets, AOI, SPI, ICT, X-Ray, EOL and maintenance logs, etc.
supervisors, engineers) during the
review of process data for assembly,
1.9 manufacturing, soldering and testing, b. The review of KPO shall include detection and reaction to out of control
justify the action to meet the conditions or alarms.
organization KPO goals (i.e., FTT,
FPY, OEE or PPM)? c. The process of reviewing the soldering process data KPO shall be
documented or computerized.

Are internal assessments being

completed on an annual basis, at a a. The organization shall conduct internal assessments on an annual
1.10
minimum, in compliance with this basis, at a minimum.
document?

a. The system shall include a documented process for rework, touch up,
etc. Authorization shall come from a cognizant individual, team of experts,
or customer requirement.

b. The above rework, touch up procedures shall be per Process Table O

Rework (i.e., IPC-7711, or equivalent). Solder touch up / rework offline at a
designated station.

c. Rework, touch up activity shall require a detail rework instructions

Is there a system in place to issued by cognizant individual as stated in section 1.11 a., and 1.11 b., and
1.11 authorize rework, touch up and is it shall be reviewed and approved by the customer.
documented?
d. Records shall clearly indicate when and how any product has been
reworked, touch up (per 1.11 b.). Note: for recurrent touch up due to
identified design, material or process related issues shall also have
records.

e. Rework, touch up product shall meet inspection standards and verified

by a secondary process such as in-circuit test, AOI, X- Ray or EOL, per
1.11 b. There should be traceability of all the rework, touch up activities
back to the technician, or station.

Does the Quality Department have

a. Yes or No to the objective evidence. It shall consist of: a problem-
objective evidence for reviewing,
1.12 solving team or individual, records, reports. Customer concerns such as
addressing, and documenting
warranties, rejects, etc.
customer and internal concerns?

a. The plan shall be designed to bring continuous improvement trends in

quality and productivity. Also, the plan shall define the individual/team
responsible for the implementation of the continuous improvement plan.
Is there a continuous improvement
plan applicable to a critical process
1.13 b. Identified improvement actions shall be prioritized and shall include a
defined in/or the Process Tables of
this document? timeline (estimated completion dates, responsible party).

c. The plan shall show effective continuous improvement (i.e., upward

trends, improvement in yields/PPM/warranties claims).
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

a. The organization shall provide the individual responsible for the

Who authorize, manage and
authorization, managing, and disposition. A process flow chart for the
1.14 disposition the flow of material in
handling of material in quarantine status shall be documented and
quarantine status?
available for review.

a. There shall be procedures or work instructions available and accessible

to the personnel covering the processes.
Are there procedures (SOP) or work
1.15 instructions available to the plant b. These procedures or work instructions shall include methods of
personnel? addressing potential emergencies (such as power failure), equipment start-
up, equipment shut-down, product inspection and general operating
procedures.

a. The organization shall provide employee training for all operations.

b. All employees associated with the assembly, manufacturing and

soldering process, including backup and temporary employees, shall be
Is training provided to the employees trained and proficient.
(i.e., managements, engineers,
1.16 technicians, operators) in the areas of c. Documented objective evidence shall be available for review showing all
assembly, manufacturing, soldering, employees are trained (including backup and temporary employees). It
testing? shall include an assessment of the effectiveness of the training.

d. The training qualification requirements for each of the areas of

assembly, manufacturing and soldering (ongoing, follow-up) shall be
addressed.

a. The organization shall maintain a responsibility matrix identifying all key

management and supervisory functions and the qualified personnel who
Is there a responsibility matrix to may perform such functions.
ensure that all key management and
1.17
supervisory functions are performed b. The matrix shall identify both primary and secondary (backup)
by qualified personnel? personnel for the key functions (as defined by the organization).

c. The matrix shall be available for review at all times to all personnel.

a. The organization shall have a documented preventive maintenance

program for key process equipment (as identified by the organization).

b. Equipment operators shall have the opportunity to report problems, and

Is there a preventive maintenance problems shall also be handled in a closed-loop manner. Operator reported
program? Is maintenance data being problems shall be used to improve the preventive maintenance program
1.18 utilized to form a predictive
maintenance program?
c. Company maintenance data (i.e., downtime, quality rejects, recurring
maintenance work orders, MTBF, MTTR).

d. Back-up equipment/power generators shall be part of the preventive

maintenance program.

Does the organization have a critical

spare part list and are the parts
available to avoid production a. The organization shall have and maintain a critical spare parts list to
1.19
disruptions in the assembly, ensure the availability of such parts to avoid disruptions.
manufacturing, soldering and testing
areas?
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Special Process: Electronic Assembly Manufacturing - Soldering Systems Assessment (General Facility Overview)

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Needs
Question Not
Question Requirements and Guidance Objective Evidence N/A Satisfactory Immediate
Number Satisfactory
Action
Section 2 - Floor and Material Handling Responsibility
a. Documented processes and evidence of compliance shall exist (i.e.,
Does the facility ensure that the data
shop travelers, work orders).
entered in the receiving system
2.1
matches the information on the
b. The facility shall have a detailed process in place to resolve receiving
customer's shipping documents?
discrepancies.

a. Procedures, and physical areas exists for part and container

Is product/material clearly identified identification to help avoid incorrect processing or mixing of lots.
and staged throughout the assembly,
2.2
manufacturing, soldering, testing
b. Piece part components, work-in-process (WIP), and finished
process?
product/goods shall be properly segregated, identified and staged
throughout the processes.

a. Piece part component suppliers lots (i.e., PCBs, Ics, passive/active

components, hardware) shall be traceable to the finished goods (i.e.,
modules, clusters harness) lot(s).

b. All products ready for shipment shall have all required assembly,
Is lot traceability maintained manufacturing, soldering and testing operations completed and
2.3 documented.
throughout all processes?

c. Work in Process traceability system that provides information of the

product status in production shall be available for review.

d. Traceability for bulk packed components used in manual insertion

processes shall be AABUS.

a. Are procedures available for the control and movement of suspect or

non-conforming product/material into the production system and mixing
with good lots.
How do you prevent movement of
non-conforming product/material into b. Procedures shall state proper disposition, product identification and
2.4
the production system and mixing tracking of material flow in and out of hold (quarantine) area.
with good product/material?
c. Suspect or non-conforming hold area shall be clearly designated to
maintain segregation of such material.

a. Containers handling customer product shall be free of foreign object

debris or particulate matter, and shall not contaminate finished goods
product.

2.5 Are containers clean? b. A procedure stating the handling, cleaning, inspection criteria and use
of after emptying and before re-using containers, shall be implemented and
available for review.

c. The source of foreign object debris or particulate matter in containers

shall be identified and addressed with a Corrective Action Plan.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
a. Handling parameters shall be specified, documented and controlled
Is part loading specified, documented
2.6 (i.e., include number of parts per rack/storage, feeder location, container fill
and controlled?
height and lots size).

a. Operators shall be trained in material handling, containment action, and

product segregation in the event of an equipment emergency or quality
issue. Training shall be documented.

Are operators trained in material b. Work instructions shall address equipment emergencies and be
handling, containment action and included in the operators training.
2.7 product segregation in the event of
an equipment emergency including
power failure? c. Work instructions shall address containment/reaction plans related to all
elements of the process (i.e., equipment emergency or quality issue).

d. Evidence shall exist showing disposition and traceability of affected

product.

a. Handling, storage, and packaging procedures shall preserve

product/material quality.
Is the handling, storage and
2.8 packaging adequate to preserve
b. Objective evidence of these procedures execution and compliance shall
product/material quality?
be seen throughout the facility (i.e., humidity, stacking max load,
temperature, ESD, expiration date).

a. Plant cleanliness, housekeeping, environmental, and working conditions

shall be conducive to controlling and improving quality per documented
procedures.

b. These conditions (cleanliness, housekeeping, environmental, safety)

Are plant cleanliness, housekeeping, shall be evaluated for their effect on quality.
environmental and safe working
2.9
conditions conducive to control and c. Cleanliness, housekeeping, environmental, and safety conditions policy
improved quality? shall be clearly documented and executed.

d. The facility shall be free of conditions (cleanliness, housekeeping,

environmental, safety) that are detrimental to the quality of the product (i.e.,
loose parts on floor, overall plant lighting, fumes, housekeeping,
operator/product temperature and humidity controls).

a. Process control parameters (as documented in the applicable Process

Parameters Tables) shall be monitored per frequencies specified in the
Process Tables of this document.

b. Is your system for traceability, computerized and data kept for the
Are process control parameters duration of the product as AABUS.
2.10 monitored per frequencies specified
in Process Tables? c. Equipment shall have alarms for process control parameters for all
processes where applicable.

d. These process parameters out of control alarms shall be communicated

to operators, technicians, engineers and other personal for resolution.

Are out of control/specification a. There are documented reaction plans for out of control and out of
2.11
parameters reviewed and reacted to? tolerance process parameters and available for review.

a. In-Process/Final Test Frequencies shall be performed as specified for

Are In-Process/Final Test
critical/function characteristics identified in Process Tables. Refer to
2.12 Frequencies performed as specified
Process Tables. Exceptions shall be documented and approved by the
in Process Tables?
customer.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

a. Test equipment shall be verified/calibrated per applicable customer

specific standard or per an applicable consensus standard (i.e., ASTM,
SAE, ISO, NIST).
2.13 Is product test equipment verified?

b. Verification/calibration results shall be internally reviewed, approved and

documented per Process Tables for frequency of checks.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Special Process: Electronic Assembly Manufacturing - Soldering Systems Assessment (Equipment)

If score is less than 85% the audit is considered "Not Satisfactory" Assessment Result: 0%

Number of items checked 0 0 0 0

Needs
Question Not
Question Requirements and Guidance Objective Evidence N/A Satisfactory Immediate
Number Satisfactory
Action
Section 3 - Equipment
Does each stage of the assembly,
a. Refer to Process Tables, Sections 2.0 and 3.0, for requirements on
3.1 manufacturing, soldering operation
process controls. See Process Parameters Tables if applicable.
have proper process controls?

a. A system shall be used by the soldering facility to track calibration dates

of equipment. This system will typically be a computerized tracking system
or other notification system.

b. Test equipment shall be verified/calibrated per customer or industry

Are process and testing equipment standard or equivalent standard (i.e., IPC, AIAG, IEC, VDA, ASTM, SAE,
3.2 calibrations and/or verification ISO, NIST).
certified, posted, and current?
c. Verification/calibration results shall be internally reviewed, approved and
documented.

d. Test equipment shall be calibrated according to its end use

environmental conditions (i.e., temperature, vibration, contamination).

Are PCB magazines, screen printer a. Supplier shall have preventative maintenance system that is
3.3 stencils, solder pallets, and other documented and implemented per the requirements in the applicable
tooling maintained? Process Tables, Section 3.0.

b. Supplier shall have adequate temperature controls ensuring that PCB

Are thermal profile requirements of
assemblies are only exposed to temperatures within the thermal
3.4 soldering operations being performed
requirements of components and the requirements in the applicable
per requirements in Process Tables?
Process Tables, Section 2.0.

a. Supplier shall have preventative maintenance system that is

documented, implemented, and available for review.
For heating zones on soldering
systems (i.e., reflow ovens, selective,
wave soldering), are temperature b. The supplier’s internal process specification shall have documented,
3.5 monitoring devices (i.e., temperature implemented, and available for review temperature requirements for
sensors, thermocouples), checked min/max conditions.
and/or replaced as required on PM
schedules? c. AABUS exceptions may exist in systems where multiple process
temperatures exist in a single process cycle as discussed in previous 3.5
b..

Do you have a process to monitor

a. Supplier shall have implemented and documented evidence of
3.6 your regulatory requirements and
regulatory requirements and safety.
safety of your employees?

b. Supplier shall have set-up parameters and calibration routines

Is manual soldering and/or rework
3.7 documented and established per the requirements in Process Table O,
equipment calibrated?
Section 2.0 and 3.0.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

a. Supplier shall have inspection equipment to evaluate solder

connection/joint quality.
Is there post soldering inspection
b. Is inspection equipment capable of discriminating all acceptability
3.8 equipment (i.e., AOI, AXI,
classes?
Magnification Aid)?
c. Does the inspection station segregate acceptable vs. rejectable units?
Manual or Automated?

Are ESD or EOS equipment a. All equipment shall be properly grounded per CQI-17, Section 2.3
3.9
standards established? References, Section 2.9, and 6.0 of Process Tables.

How frequent are process and a. Supplier shall have a list of critical equipment alarms and ensure
3.10 equipment critical alarm checks being functionality at all times and mainly during production times (i.e., product
tested? quality, equipment malfunction, safety, shipment delays).

a. There shall be a documented checklist, plan with implementation

timelines.
Is there a production restart-up
b. The checklist/plan shall provide objective evidence of production
3.11 checklist or plan in the case of
compliance to the checklist/plan.
shutdown?
c. Supplier shall perform verification of random units for compliance to
customer product requirements.

Note:
In the EAM-SSA, the word “shall” indicates a requirement for purposes of the self-assessment.
The word “should” indicates a recommendation. Where the term “such as” is used, any suggestions given are for guidance only.
• Compliance to the CQI-17 EAM-SSA is determined by:
• Ideal >= 95% of the total number of items checked on the Tables assessed (without any “Needs Immediate Action”)
• Acceptable “Satisfactory” (1) >=85% and <95%
• “Not Satisfactory” (0) <85%
• “Needs Immediate Action”. (-5) Anything non-compliance to the Table items or to customer specifications/drawings that affects Form, Fit or Function of the Product with Objective Evidence.
Compliance to each Process Table item is rated as follows:
Satisfactory = 1 point
Not Satisfactory = 0 points
Needs Immediate Action = -5 points
Not Applicable = Doesn’t count
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
Section 4 - Job Audit

This section includes final product and final product assembly and packaging

Job Identity:
Customer:
Shop Order Number:
Part Number:
Part Description:
Material:
Soldering Requirements:

Job (Shop) Order or

Related Customer or
Question Reference Actual Condition
Job Audit Question SSA Internal Pass/Fail/N/A
# Documentation (Objective Evidence)
Question # Requirement
Requirement

1.2
Are contract review, advance quality planning, FMEA, Control Plans, etc., 1.3
4.1 N/A
performed by qualified individuals? 1.4
1.17
Does the assembly, manufacturing, solder organization have the proper
4.2 1.5 N/A
customer specifications for the part?
Does the assembly, manufacturing, soldering organization have a
1.6
4.3 confirmation method to ensure correct materials, parts and components are
2.1
installed per customer requirements?
Is material identification (part numbers, lot numbers, contract numbers, 2.2
4.4 etc.) and process sequencing (repair, rework, etc.) traceable to the part 2.3
throughout the soldering process? 2.4
Is there documented evidence of a material certification with final
4.5
inspection?
1.6
4.6 Are final packaging requirements identified per customer specifications? 2.7
2.8
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
1.5
Is the proper procedure or process specification used for the soldering 1.6
4.7 process? Refer to Process Tables for specific parameters. List 2.1
parameters that were verified in this audit in the spaces provided below. 2.11
2.12

Each part may have one or more requirements determined by the

4.8 What are the product inspection requirements? 2.12 soldering specification. Parts must meet each requirement.
List each requirement below and validate.

Functional?
Dimensional?
Acceptability?
4.8.1 Requirement: Functional Test
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.2 Requirement: Dimensional Requirements
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.3 Requirement: Environmental Test
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.4 Requirement: Illumination Test
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.5 Requirement: In-Circuit Test
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.6 Requirement: Conformal Coating Conformation
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
Note: Section 4.8.7 - 4.8.12 Reserved for Auditor Observations
4.8.7 Requirement:
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.8 Requirement:
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.9 Requirement:
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.10 Requirement:
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
4.8.11 Requirement:
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:
4.8.12 Requirement:
Test Method:
Test Frequency or Quantity:
Selection of Samples:
Specification:

Operator or Inspector Responsibilities

1.4
2.2
4.9 Were appropriate process steps signed off?
2.3
2.11

Are ESD preventive methods applied (i.e., operator apparel) and

4.10 2.9
functionally verified?

1.2
4.11 Were all inspection steps, as documented in the Control Plan performed?
1.4

1.2
Were steps/operations performed that were not documented in the Control
4.12 1.4
Plan?
1.6

1.2
1.4
4.13 If additional steps were performed, were they authorized? 1.6
1.11
1.17

If the order was certified, did the certification accurately reflect the process 2.11
4.14
performed? 2.12

4.15 Was the certification signed by an authorized individual? 1.17

4.16 Are the parts and containers free of foreign objects or contamination? 2.6

Packaging Requirements
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

4.17 Are packaging requirements identified? 2.8

Are parts packaged to minimize mixed parts (parts packed over height of
4.18 2.8
container)?

Shipping Requirements

4.19 Were the parts properly identified? 2.3

2.3
4.20 Were the containers properly labeled?
2.8
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE A - Solder Paste Printing and SPI Inspection

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 MATERIALS/COMPONENTS

Work Orders or Production Schedule

1.1 1.9 PCB and Printed PCB (SPI Inspection) Bar Code/DMC/Manual Continuous Activity
Plan

Work Orders or Production Schedule

1.1.1. Correct Part Number Bar Code/DMC/Manual Lot (first and last piece)
Plan

1.1.2 PCB Shelf Life Verification Bar Code/DMC/Manual Work Instructions Lot (first piece per package)

Following Manufacturers
1.1.3 Humidity exposure after opening package controls recommendations or IPC-1601, or Work Instructions Per Lot
AABUS Documents

1.1.4 PCB Orientation (Fiducials) Equipment Set-up Equipment Manufacturer Program Continuous Activity

J-STD-005 or equivalent for Solder

2.2
1.2 Solder Paste Paste Quality, or AABUS Qualification Report One time qualification
Qualification Requirements

Container type: (i.e., jar, cartridge/tube, syringe, cassette)

1.2.1 See Marking or Labeling Work Instructions Continuous Activity
Solder Paste Supplier:

1.2.2 Correct Solder Paste Material PN Bar Code/DMC/Manual BOM Continuous Activity

1.2.3 Expiration Date/Lot Control Bar Code/DMC/Manual Product Labeling Continuous Activity

Work Instructions, or MES if s

1.2.4 Process to reach room temperature after removal from storage Bar Code/DMC/Manual Continuous Activity
available within the company

1.2.5 2.4 Removal and disposition of non-conforming material Bar Code/Check List Work Instructions Continuous Activity

1.2.6 2.4 Excess solder paste run-out disposition Manual remix/discard Work Instructions Continuous Activity

Provide manufacturer specifications

1.3 2.9 Cleaning Supply List for compatibility compliance per J- Work Instructions Continuous Activity
STD-001

2.0 EQUIPMENT/TOOLS

2.1 Solder Paste Printer

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.1.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
Description)

Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

2.2 Solder Paste Inspection (SPI) (Same as 2.1.1 and 2.1.2)

2.3 Squeegee

Type of material: (i.e., stainless steel) Following Manufacturers

2.3.1 1.18 Shape: (v-cut, straight cut) recommendations or AABUS Work Instructions Available for review
1.19 Hardness: Documents

2.3.2 Correct Squeegee Bar Code/DMC/Manual Work Instructions Continuous Activity

2.3.3 Squeegee Preventive Maintenance Replace Cleaning/Damage Inspection PM Maintenance Schedule

2.4 Pro Flow Cartridge/Rheometric/Enclosed Flow Cleaning/Damage Inspection PM Maintenance Schedule

2.5 Miscellaneous tools Provide list and use Work Instructions Continuous Activity
1.19

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

See Process Work Instructions

2.5.1 Spatula Per Documentation Continuous Activity
Section 4.0 below

3.0 TOOLING (PCB FIXTURES, PALLETS, JIGS)

3.1 Stencil

Manufacturer:
Per internal documentation, or IPC- See Process Work Instructions
3.1.1 Manufacturing Method: Available for review
7525 Section 4.0 below
Thickness:

3.1.2 Correct Stencil Bar Code/DMC/Manual Internal Documentation Every Change Over

In process Bottom Side Cleaning

Type of Cleaning Method:
3.2 Automatic or Manual Work Instructions Per Product Requirements
Chemical(s) Used:
Secluded Area or Inline:
1.18
3.3 After use Cleaning
1.6 Type of Cleaning Method:
3.3 Chemical(s) Used: Automatic or Manual Work Instructions Immediately
Secluded Area or Inline:
Storage Area

3.4 Life Expectancy Expiration Date Automatic or Manual PM Continuous Activity

3.5 Machine Alignment of Stencil to PCB Automatic Equipment Manufacturer Program Continuous Activity

3.6 Equipment PCB Support and Holder during Printing Process As Required Internal Documentation As Required

3.7 PCB Pallet or Fixture As Required Internal Documentation As Required

4.0 PROCESS WORK INSTRUCTIONS

4.1 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity

The PCP are a reflection of the

equipment, components and
Process Control Parameters (PCP) for Solder Paste Printing, and for materials used which results in
4.2 See Internal Documentation Work Instructions
Solder Paste Inspection (Upper/Lower Spec Limits) meeting the acceptability
requirements for that specific process
step.

4.2.1 Print Pressure Manual or Automatic Work Instructions Continuous or per Change Over

4.2.2 Print Squeegee Angle Manual or Automatic Work Instructions Continuous or per Change Over

4.2.3 Print Speed Manual or Automatic Work Instructions Continuous or per Change Over

4.2.4 Print Stroke (Number of passes) Manual or Automatic Work Instructions Continuous or per Change Over

4.2.5 Snap-off On Contact Work Instructions Continuous or per Change Over

1.6
4.2.6 1.15 Separation profile (speed and distance) Automatic Equipment Manufacturer Program Continuous or per Change Over

4.3 Rheometric/Enclosed Flow Automatic Preventive Maintenance Maintenance Schedule

4.3.1 Chamber Solder Paste Pressure Automatic Work Instructions Continuous Activity

4.4 Pro Flow Cassette Alignment Manual Preventive Maintenance Maintenance Schedule

4.5 Stencil Cleaning Comply with 3.1, 3.1.1 and 3.1.2

Following Manufacturers
Acceptability Requirements for Solder Paste Printing Inspection SPI Coverage and SPI Program Limits
4.6 recommendations or IPC-7527, or Continuous Activity
AUTOMATIC Criteria per component types
Internal Documentation
Misprinted PCBs disposition (Defects as shorts, off the pads) SCRAP per Manufacturing Site
4.6.1 Internal Documentation Continuous Activity
NOTE: it shall also include the components Procedure

PCBs in the lower spec of the SPI

Program Limits shall be let reflow to
4.6.2 Solder paste double printing without lifting the stencil is allowed AABUS Every time it occurs
see if complies with IPC-A-610
quantity of solder criteria.

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be maintained
and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency. Supervised on-the-job
5.0 PROCESS PERSONNEL PROFICIENCY
training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual inspection, or automated inspection
(i.e., AOI, AXI).
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Customer/Supplier/Industry Approved
5.1 Training Material Used Internal Documentation Continuous Activity
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.2 On the job training learning curve Internal Documentation Continuous Activity
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.3 Who are the instructors, (Engineers, Training Department, External) Internal Documentation Continuous Activity
Training, Objective Evidence

Instructor Proficiency (based on experience or training) on the Subject Customer/Supplier/Industry Approved

5.4 Internal Documentation Continuous Activity
Matter Training, Objective Evidence

5.5 1.16 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity
1.17
Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or
6.0 ESD Equipment/Personnel Grounded Continuous Activity
Requirements IEC 61340-5-3

Per CQI-17, Section 1.6 Other

7.0 Traceability Control Internal Documentation Continuous Activity
Requirements
Per CQI-17, Section 1.6 Other
8.0 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements

9.0 Other

Bow/Twist requirements for single PCB/PCBs in a Panel required before Do you have this issue and how is it
9.1 Internal Documentation Available for review
and after solder paste printing. handled?

Material - Process Compatibility (i.e., no mixing of Lead and Lead-free Do you have this issue and how is it
9.2 Internal Documentation Available for review
paste) handled?
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Solder Paste Printing (Table A-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process LIMITS/TOLERANCES COMMENTS

PARAMETER DESCRIPTION UNITS FREQUENCY
Table (RANGE) (CONSEQUENCES)
(2) (3) (4)
(1) (5) (6)

Print Speed mm/s Continuous Activity 25 to 100 mm/sec Print speed too fast can cause solder insufficiencies, too slow can cause solder shorts.

Low pressure can cause solder residues over the stencil apertures and cause solder
Pressure on blades Kg Continuous Activity 5 to 10 Kg
print defects, high pressure can cause blades o stencil damage.

This parameter allows the PCB to come in contact with the Stencil during print process,
Print Gap (Snap off) mm Continuous Activity 0mm to 6.35mm
recommendation use zero (0mm) to ensure contact between PCB and stencil.

Snap off Delay s Continuous Activity 0 sec. to 30 sec. Allow better solder paste separation, but increase cycle time.

Speed separation too fast can generate solder kiss effect, speed separation too slow
Speed Separation (too fast/too slow) mm/s Continuous Activity 0.03 a 1.0 mm/s
can help better solder paste release but increase cycle time.

Adjust stencil distance looking the process on each machine to ensure that all aperture
Stencil Separation mm Continuous Activity 0.7 to 1.5 mm area has separation from the PCB, is not recommended apply long distance because
affect cycle time.

Vision System Alignment N/A Continuous Activity Shall be enabled To insure alignment of fiducials on PCB vs. Stencil for correct solder paste printing.

Recommended to enable this system to ensure correct automatic stencil cleaning

Cleaning Frequency Pieces Every Number of PCB's Recommended
process to avoid plugged stencil openings.

Evaluate each product to define the correct frequency, analyze SPI system is good
Wiper (Rolls of paper) system Pieces Every 3 -5 Panels Shall be enabled
reference.

Too slow speed affect cycle time, Too fast speed can affect solder paste printing
PCB Conveyor Speed mm/s Continuous Activity 400 mm/seg to 600 mm/s
precision in the PCB.

Recommended use automatic solder paste dispenser, avoid the operator to add
Solder Paste Dispenser Mode N/A Continuous Activity Recommended
manually solder paste on the stencil.

Note #1 The above parameters applied to top and bottom sides of the PCB.

Note #2 Under comments column state or describe how such parameter affects the outcome quality of the product.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE B - Surface Mount Component Placement

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 MATERIALS/COMPONENTS

Printed Circuit Board (PCB) + Solder Paste Printed/Adhesive or Work Orders or Production Schedule
1.1 2.1 Bar Code/DMC Continuous Activity
Top/Bottom Reflowed Components Plan, BOM

2.1
2.9 Components to be placed from reels
1.2 Bar Code/DMC on reel Internal Documentation Continuous Activity
4.2 (See Note 1)
4.3

Bar Code/DMC on component

Components to be placed from tubes/trays
1.3 2.8 packaging / Works Orders or Internal Documentation Continuous Activity
(See Note 1)
Production Schedule Plan, BOM

1.4 2.2 Provide List of Consumables (i.e., splice clips and tape) Per Internal Documentation Internal Documentation/Instruction At replenishment

2.0 EQUIPMENT

2.1 Pick and Place Equipment

Per Manufacturers
Vision System (Component pick up verification (markings, polarity, Equipment Manufacturer
2.1.1 2.11 Recommendations or Internal Continuous Activity
rotation/skewing, etc.), Focusing, Illumination Documentation
Maintenance Plan

Per Manufacturers
Equipment Manufacturer
2.1.2 2.10 Vacuum System Recommendations or Internal Continuous Activity
Documentation
Maintenance Plan

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.2 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
2.11 Description)
2.12
Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.2.1 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers Per number of units

1.18 Maintenance Plan Levels - Preventive -
2.2.2 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
1.19 Operator/Technician/Engineering/Manufacturer
Maintenance Plan related

Machine Capability Study (i.e., IPC- Initial validation, and after major
2.2.3 1.7 Placement equipment (Pick and Place/Robotic) repeatability Internal Documentation
9850, or equivalent) maintenance events

1.17
2.2.4 1.18 Equipment Manufacturers Maintenance and Calibration Requirements Maintenance/Calibration Plan Maintenance Internal Documentation Maintenance/Calibration Schedule
3.2

1.4
3.0 2.11 TOOLS, FIXTURES, PALLETS and JIGS These shall be validated for supporting capacity/volume and quality metrics
2.12

3.1 Feeders/Trays (See 1.4 above) Per Component Specification Internal Documentation Continuous Activity

Per Manufacturers
3.2 Placement Nozzles (Selection, stroke and force) Recommendations or Internal Internal Documentation Continuous Activity
Maintenance Plan

Per Manufacturers
3.3 Head Recommendations or Internal Internal Documentation Continuous Activity
3.3 Maintenance Plan

Per Manufacturers
3.4 Splicing Recommendations or Internal Internal Documentation Continuous Activity
Maintenance Plan

Per Manufacturers Per number of units

Maintenance Plan Levels - Preventive -
3.5 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
Operator/Technician/Engineering/Manufacturer
Maintenance Plan related
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

4.1 1.15 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity

4.2 3.1 Process Control Parameters (PCP) Parameter Specification Limits Internal Documentation Continuous Activity

1.7
Internal QA Documentation, PV,
4.2.1 1.8 SPC Tools (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) SPC internal program Continuous Activity
PPAP, IPC-9850 or equivalent
1.9

4.2.2 How is the correct feeder location, type and size verified? Set-up per program number Internal Documentation Continuous Activity

Splicing (Causes are wrong components, nozzle contamination (missing, Per CQI-17, Section 1.6 Other
4.2.3 Internal Documentation Continuous Activity
skewed components)) Requirements

Internal QA Documentation, PV,

Monitoring Product Yields. See 4.2.1
4.3 3.1 Acceptability Requirements for Placement Equipment PPAP, IPC-A-610/J-STD-001 or Continuous Activity
for SPC Tools
applicable

Verification of compliance with IPC-A-610, J-STD-001, AOI Catalog

4.3.1 3.8 Visual Acceptability Criteria - Manual vs. AOI Continuous Activity
product requirements Visual Requirements or equivalent

Verification of compliance with

4.3.2 3.9 ICT, Functional Test, etc., as dictated by process flow/routing Product Test Specification Continuous Activity
product requirements

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be maintained
1.4
and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency. Supervised on-the-job
5.0 2.11 PROCESS PERSONNEL PROFICIENCY
training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual inspection, or automated inspection
2.12
(i.e., AOI, AXI).

Customer/Supplier/Industry Approved
5.1 1.16 Training Material Used Internal Documentation Continuous Activity
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.2 1.13 On the job training learning curve Internal Documentation Continuous Activity
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.3 1.17 Who are the instructors (Engineers, Training Department, External) Internal Documentation Continuous Activity
Training, Objective Evidence

Instructor Proficiency (based on experience or training) on the Subject Customer/Supplier/Industry Approved

5.4 Internal Documentation Continuous Activity
Matter Training, Objective Evidence
1.5

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

Documented, coordinated by Human

5.6 Technical Support Levels (Engineering, Technicians, Operator) Internal Documentation Continuous Activity
Resources
1.17
Internal Documentation or Industry
5.6.1 Technical Support Level - Knowledge Required per Level Determined by the job requirements Continuous Activity
Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or

6.0 ESD Equipment/Personnel Grounded Continuous Activity
Requirements IEC 61340-5-3

2.1
Per CQI-17, Section 1.6 Other
7.0 2.2 Traceability Control Internal Documentation Continuous Activity
Requirements
2.3

Per CQI-17, Section 1.6 Other

8.0 2.7 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements

9.0 Other
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Surface Mount Component Placement (Table B-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process LIMITS /TOLERANCES COMMENTS

PARAMETER DESCRIPTION UNITS/WHAT IS MONITORED? FREQUENCY
Table (RANGE) (CONSEQUENCES)
(2) (3) (4)
(1) (5) (6)

A Robotic Placement

Feeders Seated into Home Position Feeders Every feeder install Home position or not Missing Component/(Mispicks/Dropped/No pick)

Feeder size match component package Feeder size (i.e. 8mm) vs. Every reel, tray, tube
Match or not Missing Component/(Mispicks/Dropped/No pick)
(incorrect) package install/change

Percentage of
Manufacturers recommendations
Feeder maintenance Number of picks or time mispicks/dropped/no pick (i.e., Missing Component/(Mispicks/Dropped/No pick)
or as needed
component cost consideration)

Particulate matter, dirt, loose

Feeder cart slots cleanliness Every feeder install Clean or not Missing Component/(Mispicks/Dropped/No pick)
components

Feeder cart pre-setup Feeder slot Number and size =

Every pre-setup Match or not Wrong Component
(Assembly Line or Dedicated Area) Component P/N

PCB warping Bow/twist (mm) Every board 80 microns or 08 mm Misalignment Issues

Marking on PCB (laser

PCB Marking Every board Match or not Wrong Built/Revision
mark/label/etc.)

PCB clamped, secure PCB Every board Clamped or not Misalignment Issues

Vacuum limits are constant value

Nozzle Vacuum (i.e., vacuum pump Nozzle Vacuum or Vacuum pump Manufacturers recommendations
depending on nozzle size and Missing Component/(Mispicks/Dropped/No pick)
control, gauge to measure vacuum level) values or as needed
type

Manufacturers recommendations
Placement Speed Component size High/Medium/Slow Missing Component/Misalignment issues
or as needed

Nozzle size, component package

Nozzle size vs. Component package Placement Programming Match or not Missing Component/(Mispicks/Dropped/No pick)
(odd custom packages)

Component reel type Paper, plastic, etc. Placement Programming Match or not Missing Component/(Mispicks/Dropped/No pick)

Placement Programming height

Missing Component/(Mispicks/Dropped/No pick),
Component Pick Height Control (Z-AXIS) Component size, pickup height sensor check if tool has the Match or not
Damaged Component
capability.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Component rotation angle and Manufacturers recommendation or

Component angle and position Every component Missing Component/(Mispicks/Dropped/No pick)
center position programmed value

Flat, Non porous, Non-greasy, X-

Component Surface Compliance - Material Every component Pick or not Missing Component/(Mispicks/Dropped/No pick)
Y position pick

Component Physical Characteristics

Leads, coplanarity, polarity marks. Every component Match or not Missing Component/(Mispicks/Dropped/No pick)
Recognition

Component/Feeder Location Position Feeder position Every feeder install Detection or not Wrong Component

B Splicing Process Wrong Component

Correct Part Number Matching on

Component Reel Splicing - Correct Part
Machine vs. Reel Label In vs. Every splicing Match or not Wrong Component
Number
Reel Label Out

Smart feeder/Sensor to detect

Component Presence Detection, Splicing
splicing section/Poka-Yoke Every splicing Detection or not Missing Component/(Mispicks/Dropped/No pick)
gap
equipment/process

C Manual Insertion List of Manual Insertion Every board Detection or not Reversed/Wrong Polarity Component

Poka-Yoke established
Production Schedules Loading Every built Detection or not Wrong Built
(i.e., MES)

Note #1 The above parameters applied to top and bottom sides of the PCB.

Note #2 Under comments column state or describe how such parameter affects the outcome quality of the product.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE C - Reflow + Automated Inspection (AOI, AXI) vs Manual

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 MATERIALS/COMPONENTS

Work Orders or Production Schedule

1.1 2.1 Printed Circuit Assembly (PCA) Bar Code/DMC Continuous Activity
Plan, BOM

2.1
Provide List of Materials (i.e., flux, solder, nitrogen, cooling water, lubricant Per Documentation from
1.2 2.9 Internal Documentation Continuous Activity
oil) with Manufacturer Specifications, Data Sheet (See Note 1) Manufacturers
4.2

Provide a List of Consumables (i.e., thermal gloves, wipes, filters) with Per Documentation from
1.3 2.8 Internal Documentation Continuous Activity
Manufacturer Specifications, Data Sheet (See Note 1) Manufacturers

2.0 EQUIPMENT

Reflow Oven (Infrared, Convection, Vapor Phase, Vacuum), AOI, AXI, Depends on product dimension and Equipment Manufacturer
2.1 1.3 Available for review
Manual Inspection Equipment population Documentation/Evaluation

Equipment Manufacturer Specifications (i.e., Operations Manual,

3.4 Equipment Manufacturer
2.1.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
3.5 Documentation
Description)

2.11 Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
2.12 Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers
Maintenance Plan Levels - Preventive - Per number of units tested, or time
2.1.3 1.18 Recommendations or Internal Maintenance Plan Documentation
Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

Measurement System Analysis Initial validation, and after major

2.1.4 3.2 Reflow oven repeatability Internal Documentation
(MSA) procedure maintenance events

Equipment Manufacturers Maintenance and Calibration Requirements

2.1.5 1.18 (Reflow Oven - Infrared, Convection, Vapor Phase, Vacuum), AOI, AXI, Maintenance/Calibration Plan Maintenance Internal Documentation Maintenance/Calibration Schedule
Manual Inspection Equipment

Depends on product dimension and Equipment Manufacturer

2.2 Thermal profile measurement system Available for review
population Documentation/Evaluation

2.2.1 Thermal profile measurement system calibration Maintenance/Calibration Plan Maintenance Internal Documentation Maintenance/Calibration Schedule
3.2
3.6
Depends on product dimension and Equipment Manufacturer
2.3 Internal or external continuous profiles system if used Available for review
population Documentation/Evaluation

2.3.1 Internal or external continuous profiles system calibration Maintenance/Calibration Plan Maintenance Internal Documentation Maintenance/Calibration Schedule

3.0 TOOLS, PCB FIXTURES, PALLETS, JIGS

Type K/Supplier verification of

3.1 Thermal Profile Reader/Thermocouples Internal Documentation Available for review
tolerances
3.2
3.6 Per Manufacturers
Maintenance Plan Levels - Preventive - Per number of units tested, or time
3.2 Recommendations or Internal Maintenance Plan Documentation
Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

4.0 PROCESS WORK INSTRUCTIONS

4.1 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity

Per component/solder paste

4.2 1.6 Process Control Parameters (PCP) Product Test Specification Continuous Activity
specification limits

Minimum Parameters: Conveyor Speed, Preheat slope, Soak period, Time Per component/solder paste
4.2.1 Product Test Specification Continuous Activity
Above Liquidus (TAL), Max temp/Time period, Cool down rate specification limits
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

1.8 SPC Tools Internal QA Documentation, PV,

4.2.2 SPC internal program Continuous Activity
1.9 (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) PPAP or equivalent

Monitoring Product Yields. See 4.2.2 Internal QA Documentation, PV,

4.3 Acceptability Requirements for reflow oven Continuous Activity
for SPC Tools PPAP or applicable

1.) Be continuous Activity, or

Automotive Addenda IPC-A-610, J-
Verification of compliance with 2.) consist of sampling inspection if
4.3.1 Visual Acceptability Criteria - AOI STD-001, AOI Catalog Visual
product requirements defined as part of a documented
Requirements or Equivalent
process Control Plan

1.) Be continuous Activity, or

Automotive Addenda IPC-A-610, J-
Verification of compliance with 2.) consist of sampling inspection if
4.3.1.1 Visual Acceptability Criteria - AXI STD-001, AXI Catalog Visual
product requirements defined as part of a documented
Requirements or Equivalent
process Control Plan

Equipment/product new
Following MSA (AIAG) guidelines or launch/release, after calibration, per
4.3.1.2 AOI/AXI capability thru Gage R&R Studies, Internal Documentation
1.5 equivalent equipment manufacturers
recommendations, defect escape

Verification of compliance with IPC-A-610, J-STD-001, AOI Catalog

4.3.1.3 Visual Acceptability Criteria - Manual Inspection Continuous Activity
product requirements Visual Requirements or Equivalent

4.4 See Section 5.0 for Personnel Proficiency Requirements.

AXI Catalog of Visual

Verification of compliance with
4.4.1 X-Ray Inspection for Hidden Connections Requirements/Criteria, Inspection Continuous Activity
product requirements
Coverage Matrix

ICT/Boundary Scan, Functional Test, etc., as dictated by process Verification of compliance with
4.4.2 Product Test Specification Continuous Activity
flow/routing product requirements

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be maintained
5.0 PROCESS PERSONNEL PROFICIENCY and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency. Supervised on-the-job
training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks such as manual visual inspection, or automated inspection (i.e., AOI, AXI).

Customer/Supplier/Industry Approved
5.1 Training Material Used Internal Documentation Available for review
Training, Objective Evidence
1.16
Customer/Supplier/Industry Approved
5.2 On the job training learning curve Internal Documentation Available for review
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.3 Who are the instructors, (Engineers, Training Department, External) Internal Documentation Available for review
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.4 Instructor Proficiency (based on experience or training) on the Subject Matter Internal Documentation Available for review
Training, Objective Evidence

1.17 Proficiency Demonstration

5.5 Actual live demonstration Internal Documentation Available for review
(i.e., thermal profiling)

Technical Support Levels Documented, coordinated by Human

5.6 Internal Documentation Available for review
(Engineering, Technicians, Operator) Resources

Internal Documentation or Industry

5.6.1 Technical Support Level - Knowledge Required Determined by the job requirements Available for review
Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or

6.0 3.9 ESD Equipment/Personnel Grounded Continuous Activity
Requirements IEC 61340-5-3

Per CQI-17, Section 1.6 Other

7.0 4.3 Traceability Control Internal Documentation Continuous Activity
Requirements

Per CQI-17, Section 1.6 Other

8.0 4.2 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements

9.0 Other

Pre reflow: Incoming Inspection

Coplanarity measured before and 610/001 Automotive Addendum,
9.1 Bow/Twist requirements for complex BGA, LGA, QFN components Post reflow: sampling (destructive
after solder reflow Internal Documentation
test)
Do you have this issue and how is it
9.2 3.5 Component - Process Compatibility for temperature reflow, flux, etc. Internal Documentation Available for review
handled?

Note 1: Shall provide documentation how Lead vs. Lead free are segregated.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Reflow Oven (Table C-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process UNITS/WHAT IS COMMENTS

PARAMETER DESCRIPTION FREQUENCY LIMITS /TOLERANCES (RANGE)
Table MONITORED? (CONSEQUENCES)
(2) (4) (5)
(1) (3) (6)

Product Name Profile N/A Continuous Activity N/A Wrong product selection

Per Bill of Materials (BOM) and/or Production

PCB Part Number - Revision Level N/A Continuous Activity Wrong product processed
Schedule

Nitrogen N/A Continuous Activity Shall be Enable if Needed or AABUS Wetting issues with PCB or component solderability

<500ppm oxygen preferred, not >1000ppm

Nitrogen Level Oxygen ppm level Continuous Activity Wetting issues with PCB or component solderability
oxygen

LOT Number, PART Per Bill of Materials (BOM) and/or Production Non compliance with BOM/Production Schedule
Solder paste Continuous Activity
Number Schedule Requirements

Incomplete reflow, burned, component thermal limits

Conveyor speed mm/min (in/min) Continuous Activity (+/-) 25.4mm, (+/-) 1 in
violations

Conveyor Width Position in; mm; Continuous Activity +/- 1.5 mm Scrap Dropped PCB

Upon Reflow Oven Recommendations, and PCB To avoid warpage issues, and damage to components
Center Board Support - Position mm Continuous Activity
design. Shall be enables if needed already assembled and soldered

(+/-) 10°C, (+/-) 50°F or Reflow Oven Incomplete reflow, burned, component thermal limits
Oven Temperature Setting °C;°F Continuous Activity
Recommendations Alarms violations

High and Low Settings, according to Oven

Manufacturers Recommendations. (by default is
RPM/LEVELS and
Oven Fan Setting Continuous Activity 1.2) Note: each EMS supplier needs to change Blown components, reflow issues, excess temperatures
PRESSURE
this value to avoid the items listed in the
consequences

Every time a profile

No more than 3 °C /sec, measure every 10 PCB/Component PCB/Component Delamination, Solder
Ramp Up Rate (average 10s) °C/sec; °F/sec measurement is done or
seconds reflow issues Delamination
required

Every time a profile

No more than 6 °C /sec, measure every 10
Ramp Down Rate (average 10s) °C/sec; °F/sec measurement is done or PCB/Component Delamination, Solder reflow issues
seconds
required

Every time a profile

60 to 120 sec; Consult with Solder Paste Wetting issues with PCB or component solderability.
Soak Time sec measurement is done or
Manufacturer Recommendations Excess flux impacting test point contamination.
required
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
Every time a profile
Incomplete reflow, burned, component thermal limits
Peak Temperature °C measurement is done or 235Min-260Max °C
violations
required

Every time a profile

Incomplete reflow, burned, component thermal limits
Time Above Liquidus (DWELL TIME) sec measurement is done or 30 to 90 sec.
violations
required
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE D - Adhesive Dispensing - Component Fixation and Mechanical Support

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

In this Process Table adhesive dispensing refers to Potting, Sealing, Gluing, Underfill, Hot melt.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 MATERIALS/COMPONENTS
2.12

PCB (For PCB Acceptability Criteria/Requirements see IPC-A-600 or IPC- Work Orders or Production Schedule
1.1 Bar Code/DMC/Manual Continuous Activity
6010 Family) Plan
1.5
1.2 2.2 PCB Flatness Surface Plate, Manual PCB drawing specification Per incoming inspection plan

1.3 Solder Mask flatness/finish Surface Plate, Manual PCB drawing specification Per incoming inspection plan

1.6
Provide List of Materials (i.e., adhesive, cleaner, coatings) with Per Documentation from
1.4 2.1 Internal Documentation Continuous Activity
Manufacturer Specifications, Data Sheet (See Note 1) Manufacturers
2.9

1.6 Provide a List of Consumables (i.e., gloves, wipes) with Manufacturer Per Documentation from
1.5 Internal Documentation Continuous Activity
2.8 Specifications, Data Sheet (See Note 1) Manufacturers

IPC-HDBK-4691 Handbook on
1.5 Adhesive Bonding in Electronic One time qualification or when
1.6 Adhesive Qualification Report
1.6 Assembly Operations, and Design adhesive' supplier change
Qualification Requirements

1.6
1.7 How is the Correct Adhesive verified? Bar Code or Manual Internal Documentation Continuous Activity
1.15

2.3
1.8 How is Expiration Date/Lot Control verified? Bar Code or Manual Internal Documentation Continuous Activity
2.9

1.6
1.9 How is the Adhesive stabilize to operation temperature verified? Bar Code or Manual Internal Documentation Continuous Activity
1.15

2.4
1.10 Open Container Disposition Per Documentation Internal Documentation Continuous Activity
2.8

1.4
2.0 2.11 Equipment
2.12

1.6
Acceptability Requirements for
2.1 1.7 Adhesive dispensing and Adhesive Inspection System (if applicable) Internal Documentation Continuous Activity
adhesive inspection (if applicable)
1.16

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.1.1 1.19 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
2.11 Description)
2.12
3.2 Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
Training, Critical Spare Parts.) Section 4.0 below

Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units solder paste
2.1.3 Recommendations or Internal Maintenance Plan Documentation
3.3 Operator/Technician/Engineering/Manufacturer printed, or time related
Maintenance Plan

Following Manufacturers
Coverage Program Limits and Criteria
2.1.4 1.7 Acceptability Requirements for adhesive inspection (if applicable) recommendations or Internal Continuous Activity
per component type
Documentation

1.4
3.0 2.11 TOOLS, FIXTURES,PALLETS, JIGS
2.12

3.1 1.18 Equipment PCB Support/Holder during Dispensing Process As Required Internal Documentation As Required

3.2 3.3 PCB Pallet or Fixture As Required Internal Documentation As Required

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units solder paste
3.3 Recommendations or Internal Maintenance Plan Documentation
3.3 Operator/Technician/Engineering/Manufacturer printed, or time related
Maintenance Plan

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

1.6
4.1 Provide written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity
1.15

Process Control Parameters (PCP) for Adhesive Dispensing and SPI:

1. Air pressure time The PCP are a reflection of the
2. Nozzle size equipment, components and
1.6
3. Stand off height Per Equipment Manufacturer materials used which results in
4.2 1.15 Internal Documentation
4. Droplet number Specifications meeting the acceptability
3.1
5. Temperature Control (nozzle) requirements for that specific process
6. Conveyor width step
7. Conveyor speed

2.3
4.2.1 How is correct PCB Part Number verified? Bar Code/DMC/Manual Internal Documentation Available for review
2.7

4.2.2 2.9 How is PCB Shelf Life verified? Bar Code/DMC/Manual Internal Documentation Available for review

Following Manufacturers
How do you control PCB humidity exposure after opening package
4.2.3 2.9 recommendations or IPC-1601, or Internal Documentation Available for review
controls?
AABUS Documents

2.3
4.3 How is the proper Adhesive verified? Bar Code/DMC/Manual Internal Documentation Available for review
2.7

4.3.1 2.9 How is the Adhesive Shelf Life verified? Bar Code/DMC/Manual Internal Documentation Available for review

1.6 Provide written procedure for Adhesive to reach room temperature after Bar Code or DMC or Manual, Per
4.3.2 Internal Documentation Available for review
1.15 removal from storage. Manufacturers Specification

Provide written procedure for removal and disposition of non-conforming

4.3.3 Disposition procedures Internal Documentation Available for review
and left over/unused Adhesive.
1.6
2.4
What is your procedure for handling defects on adhesive dispensing
4.3.4 Disposition procedures Internal Documentation Available for review
(adhesive placement, adhesive volume, etc.)?

1.6
4.4 How is the correct Dispensing Nozzle verified? Bar Code/DMC/Manual Internal Documentation Available for review
1.16

Internal Documentation, or IPC-

Per Internal Documentation or HDBK-4691 Handbook on Adhesive
4.5 1.6 Acceptability Requirements Adhesive Dispensing Continuous Activity
Specification Bonding in Electronic Assembly
Operations

1.16 Verification of adhesive placement IPC-A-610, AOI Catalog Visual

4.5.1 Visual Acceptability Criteria - Manual vs. AOI Continuous Activity
3.8 compliant with product requirements Requirements or Equivalent

Per Internal Documentation or

4.5.2 Adhesive Volume Internal Documentation Continuous Activity
Specification

Per Internal Documentation or

4.5.3 Adhesive placement Internal Documentation Continuous Activity
1.6 Specification
1.15
1.16 Per Internal Documentation or
4.5.4 Adhesive curing verification Internal Documentation Continuous Activity
Specification

Per Internal Documentation or

4.5.5 Adhesive contamination on component pad Internal Documentation Continuous Activity
Specification

1.4
Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be maintained
1.16
and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency. Supervised on-the-job
5.0 1.17 PROCESS PERSONNEL PROFICIENCY
training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual inspection, or automated inspection
2.11
(i.e., AOI, AXI).
2.12

1.16 Customer/Supplier/Industry Approved

5.1 Training Material Used Internal Documentation Continuous Activity
2.8 Training, Objective Evidence

Customer/Supplier/Industry Approved
5.2 On the job training learning curve Internal Documentation Continuous Activity
Training, Objective Evidence

1.16
Customer/Supplier/Industry Approved
5.3 1.17 Who are the instructors, (Engineers, Training Department, External) Internal Documentation Continuous Activity
Training, Objective Evidence
2.8
CQI-17
1.16 Special Process: Electronic Assembly Manufacturing-
1.17 Soldering System Assessment (EAM-SSA)
2.8 Version 2, August 2021

Instructor Proficiency (based on experience or training) on the Subject Customer/Supplier/Industry Approved

5.4 Internal Documentation Continuous Activity
Matter Training, Objective Evidence

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

5.6 1.16 Documented, coordinated by Human

Technical Support Levels (Engineering, Technicians, Operator) Internal Documentation Continuous Activity
1.17 Resources

Internal Documentation or Industry

5.6.1 Technical Support Level - Knowledge Required Determined by the job requirements Continuous Activity
Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or

6.0 3.9 ESD Equipment/Personnel Grounded Continuous Activity
Requirements IEC 61340-5-3

Per CQI-17, Section 1.6 Other

7.0 2.3 Traceability Control Internal Documentation Continuous Activity
Requirements

Per CQI-17, Section 1.6 Other

8.0 2.7 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements

9.0 Other

Note 1: Shall provide documentation how Lead vs. Lead free are segregated.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE E - Wave/Selective Solder for Thru Hole Technology Process + Visual Inspection/AXI
(Hidden Connections)

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 MATERIALS/COMPONENTS
2.12

1.5 Work Orders or Production Schedule

1.1 Printed Circuit Assembly (PCA) Bar Code/DMC Continuous Activity
2.2 Plan, BOM

1.6 Provide List of Materials (i.e., flux, solder, nitrogen, compressed air, solvent
Per Documentation from
1.2 2.1 cleaner) with Manufacturer Specifications, Data Sheet Internal Documentation Continuous Activity
Manufacturers
2.9 (See Note 1)

1.6 Provide a List of Consumables (i.e., thermal gloves, wipes, filters) with Per Documentation from
1.3 Internal Documentation Continuous Activity
2.8 Manufacturer Specifications, Data Sheet (See Note 1) Manufacturers

1.4
2.0 2.11 EQUIPMENT
2.12

1.6
Wave/Selective Solder System (Fluxer, pre-heaters, solder pots, cooling Depends on product dimension and Equipment Manufacturer
2.1 1.7 Available for review
fans, nitrogen atmosphere, conveyor system, etc.) population Documentation/Evaluation
1.16

Equipment Manufacturer Specifications (i.e., Operations Manual,

1.19 Equipment Manufacturer
2.1.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
2.11 Documentation
Description)
2.12
3.2 Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units tested, or time
2.1.3 Recommendations or Internal Maintenance Plan Documentation
3.3 Operator/Technician/Engineering/Manufacturer related
Maintenance Plan.

2.1.4 3.2 Equipment Manufacturers Maintenance and Calibration Requirements Maintenance/Calibration Plan Maintenance Internal Documentation Maintenance/Calibration Schedule

1.4
3.0 2.11 TOOLS, PCB FIXTURES, PALLETS, JIGS
2.12

1.6
Type K/Supplier verification of IPC-7530, or Internal Documentation,
3.1 1.18 Thermal Profile Reader/Thermocouples Available for review
tolerances or equivalent.
3.5

Maintenance Plan and Validation

3.2 Fixture/Pallets Condition and Purpose Available for review
Documentation
1.18
3.3 Per Manufacturers
Maintenance Plan Levels - Preventive - Per number of units tested, or time
3.3 Recommendations or Internal Maintenance Plan Documentation
Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12
1.6
4.1 Provide Written Work Instructions and Process Flow Chart Automated or Manual Process Internal Documentation Continuous Activity
1.15

1.6
Per component/solder paste
4.1.1 1.7 Process Control Parameters (PCP) Product Test Specification Continuous Activity
specification limits
3.1

Minimum Parameters: Conveyor Speed, Preheat slope, Soak period, Time Per component/solder paste
4.1.2 3.1 Product Test Specification Continuous Activity
above liquidus (TAL), Dwell Time (Max temp/Time period), Cool down rate. specification limits
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
1.7
SPC Tools Internal QA Documentation, PV,
4.1.3 2.12 SPC internal program Continuous Activity
(i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) PPAP or equivalent
3.1

Monitoring Product Yields. Internal QA Documentation, PV,

4.2 1.6 Acceptability Requirements for wave solder Continuous Activity
See 4.1.3 for SPC Tools. PPAP or equivalent

Monitoring Product Yields. Internal QA Documentation, PV,

4.2.1 Spray fluxing quantity test Continuous Activity
See 4.1.3 for SPC Tools. PPAP or equivalent

1.6 Monitoring Product Yields. Internal QA Documentation, PV,

4.2.2 Conveyor planarity test Continuous Activity
1.15 See 4.1.3 for SPC Tools. PPAP or equivalent
1.17
2.12 Monitoring Product Yields. Internal QA Documentation, PV,
4.2.3 Thermal profile measurement system Continuous Activity
3.1 See 4.1.3 for SPC Tools. PPAP or equivalent

Monitoring Product Yields. Internal QA Documentation, PV,

4.2.4 Oxygen Analyzer measurement system Continuous Activity
See 4.1.3 for SPC Tools. PPAP or equivalent

1.6
1.15 Verification of compliance with IPC-A-610, J-STD-001, Catalog
4.3 Visual Acceptability Criteria - Manual vs. AOI (Optional) Continuous Activity
1.17 product requirements Visual Requirements or Equivalent
3.8

1.6
Verification of compliance with AXI Catalog of Visual
4.3.1 1.17 X-Ray Inspection for Hidden Connections At product launch or PVs
product requirements Requirements/Criteria
3.8

1.4
Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be maintained
1.16
and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency. Supervised on-the-job
5.0 1.17 PROCESS PERSONNEL PROFICIENCY
training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual inspection, or automated inspection
2.11
(i.e., AOI, AXI).
2.12

1.16 Customer/Supplier/Industry Approved

5.1 Training Material Used Internal Documentation Available for review
2.8 Training, Objective Evidence

Customer/Supplier/Industry Approved
5.2 On the job training learning curve Internal Documentation Available for review
Training, Objective Evidence

1.16
Customer/Supplier/Industry Approved
5.3 1.17 Who are the instructors, (Engineers, Training Department, External) Internal Documentation Available for review
Training, Objective Evidence
2.8

Instructor Proficiency (based on experience or training) on the Subject Customer/Supplier/Industry Approved

5.4 Internal Documentation Available for review
Matter Training, Objective Evidence

5.5 Proficiency Demonstration (i.e., thermal profiling) Actual live demonstration Internal Documentation Available for review

1.16 Documented, coordinated by Human

5.6 Technical Support Levels (Engineering, Technicians, Operator) Internal Documentation Available for review
1.17 Resources

Internal Documentation or Industry

5.6.1 Technical Support Level - Knowledge Required Determined by the job requirements Available for review
Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or

6.0 ESD Equipment/Personnel Grounded Continuous Activity
Requirements IEC 61340-5-3

Per CQI-17, Section 1.6 Other

7.0 2.3 Traceability Control Internal Documentation Continuous Activity
Requirements

Per CQI-17, Section 1.6 Other

8.0 2.7 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements

9.0 Other

1.6 Bow/Twist requirements for single PCB/PCBs in a Panel required before PCBs that have 1.5% Bow and
9.1 Internal Documentation Available for review
1.16 and after wave solder Twist?

1.7
Do you have this issue and how is it
9.2 2.11 Component - Process Compatibility Internal Documentation Available for review
handled?
2.12

Note 1: Shall provide documentation how Lead vs. Lead free are segregated.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Wave/Selective Soldering (Table E-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process UNITS/WHAT IS COMMENTS

PARAMETER DESCRIPTION FREQUENCY LIMITS /TOLERANCES (RANGE)
Table MONITORED? (CONSEQUENCES)
(2) (4) (5)
(1) (3) (6)

Product Name N/A Continuous Activity Contract/drawing Wrong product selection

PCB identification N/A Continuous Activity Drawing Wrong product processed

Material: Continuous Activity

Solder material Container Continuous Activity BOM (LF or Pb) Noncompliance to materials requirements

Flux material Container Continuous Activity BOM (LF or Pb) Wetting issues

Flux type Container Continuous Activity BOM (ROL0/REL0) Wetting issues

% Flux solid content % Continuous Activity BOM (<5 %) Cleaning, residues issues

Equipment Parameters: Continuous Activity

Solder bath positions (X, Y, Z positions) mm Continuous Activity Per product design requirements Excess, insufficient solder, shorts

According to the soldered areas

Flux station positions (all) mm Continuous Activity (Flux is not applied to correct Wetting, cleaning, solderability
locations)

Flux speed profile ml/min Continuous Activity Per manufacturers specification Wetting issues, solder peaks, cleaning, residues

Flux amount high/medium/low Continuous Activity Medium Wetting issues, solder peaks, cleaning, residues

% of heating elements
Pre heating power Continuous Activity Per manufacturers specification Solder balls, reflow issues
actives

Pre heating time sec Continuous Activity According to flux specification Solder balls, reflow issues

According to flux specification

Part temperature after pre-heating stage °C Continuous Activity (Commonly 100 degrees C for PB, Wetting issues, cleaning/residues issues
120 degrees C Lead Free)

Parameter software controlled

Solder pump speed % Per manufacturers specification Wetting issues
automatically

Every shift change, after PM, job

Wave height mm Per product type Insufficient, excess solder (bridging)
set-up
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Parameter software controlled

Nitrogen gas liter/min or ppm Per product type or AABUS Wetting and solderability issues
automatically

As required per product type or job

Nozzle type if required Per product type, job set-up Insufficient, excess solder (bridging)
set-up

Set-up PCB profile parameters:

Continuous or verify with the Weekly to monthly. Depending on Delamination issues, maximum component temperature
Ramp Up Rate (average 10s) °C/min; °F/min
profiler process capability. (<3°C/sec) damage,

Continuous or verify with the Weekly to monthly. Depending on

PCB Profile Preheat Time sec Wetting issues
profiler process capability. (100 - 150°C)

Weekly to monthly. Depending on

process capability. (Lead Free (270
Continuous or verify with the Wetting issues, maximum component temperature
Wave Solder Temperature °C; °F C) vs. Pb (260 C) Alloys (See J-
profiler damage
STD-001 or equivalent for
Temperature Tolerance)

Continuous or verify with the Weekly to monthly. Depending on

Dwell Soldering Time sec Wetting (fusion point) issues
profiler process capability. (4 - 8 sec)

Continuous or verify with the Weekly to monthly. Depending on

Ramp Down Rate (average 10s) (Cool down) °C/min; °F/min Pad cratering, disturbed solder connections
profiler process capability. (< 6°K/sec)
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE F - Automated (Robotic) Iron Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 Equipment
2.12

1.1 Flux Application (if used) See Process Table F

1.2 Pre-heat Process (if used) See Process Table G

1.3 Conveyer

1.3.1 Width control Per set-up Per Control Plan

1.3.2 Speed/index control Automatic per Control Plan Continuous Activity

1.3.3 Infeed cover In place Continuous Activity

1.4 Soldering Iron

1.4.1 Temperature controller Correct Temperature Continuous Activity

1.4.2 1.18 Heating element Proper PM PM Completion Report

1.4.3 1.6 Iron tip temperature calibration Per specification Per Control Plan

1.4.4 1.6 Correct Tip (shape/size/material) Per specification Per Control Plan

1.4.5 Iron tip cleaner Per Control Plan Continuous Activity

1.4.6 1.18 Iron tip maintenance Proper PM PM Completion Report

1.5 Solder

1.5.1 1.6 Correct Solder (type/size/core) Per specification Per Control Plan

1.5.2 Solder Lot Control Bar Code or Manual Per Control Plan

1.6 Atmosphere Control

1.6.1 Ventilation Automatic Continuous Activity

1.6.2 Nitrogen supply system (if used) Automatic Continuous Activity

1.6.3 Surveyor (Thermoprofile measurement) Automatic Continuous Activity

1.7 3.9 ESD Control Per ANSI S20.20 Per Control Plan

1.8 Pb/Pb free changeovers Proper equipment cleaning Per Control Plan Per Changeover

Solder preparation per

1.9 Solder ball control customer agreement (i.e., V- 100%
groove cutter)
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE F - Automated (Robotic) Iron Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action
1.4
2.0 2.11 Automated Solder Process Control
2.12

2.1 Tip contact position Per Product Specification Continuous Activity

2.2 Tip contact dwell time Per Product Specification Continuous Activity

2.3 1.6 Solder contact position Per Product Specification Continuous Activity

2.4 Solder feed rate Per Product Specification Continuous Activity

2.5 Angle of contact Per Product Specification Continuous Activity

1.4
3.0 2.11 Loading
2.12

3.1 Correct Orientation Automatic/operator training Continuous Activity

3.2 Stiffeners (if used) correct placement Operator Training Continuous Activity
1.15, 1.16
3.3 Correct Spacing Automatic/operator training Continuous Activity

3.4 Proper placement in pallet (if used) Operator Training Continuous Activity

1.4
4.0 2.11 Unloading
2.12

4.1 3.9 ESD Control Per ANSI S20.20 Per Control Plan

4.2 1.15, 1.16 Proper Handling Operator Training Continuous Activity

4.3 Cooling/Ion Blowers

4..3.1 Filters presence Per Control Plan Per Preventative Maintenance

4.3.2 1.6 Proper location on conveyor Per spec/set-up Daily Check Sheet

4.3.3 Blower Operation indicator Per Control Plan Daily Check Sheet

4.4 Magazines/Unloading racks Per Product Specification Per Changeover

4.4.1 Correct Type for product (Pb/Pb free) Per Control Plan Continuous Activity

4.4.2 Correct width and height for product Per Control Plan Continuous Activity

4.4.3 Correct loading sequence (top down) Per Control Plan Continuous Activity

4.4.4 Covered for transportation and storage Per Control Plan Continuous Activity

4.5 Pallet Cleaning Per Control Plan Per Control Plan

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE F - Automated (Robotic) Iron Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action
1.4
5.0 2.11 Component Compatibility
2.12

5.1 1.6 Components compatible with iron temperature Component Spec Design Review

5.2 1.6 Components compatible with solder Component Spec Design Review

1.4
6.0 2.11 Warpage Control
2.12

Maximum diagonal warpage meets standard (warpage of the PCB cannot Per IPC-TM-650,
6.1 Changeover/profile modification
be affected by this process) Section 2.4.22

1.4
7.0 2.11 Abnormal Condition Reaction
2.12

7.1 Power failure reaction plan Per Control Plan Continuous Activity

7.2 Emergency-stop reaction plan Per Control Plan Continuous Activity

7.3 2.8 Part jam reaction plan Per Control Plan Continuous Activity

7.4 Drop part reaction plan Per Control Plan Continuous Activity

7.5 In Process Delay Reaction Plan Per Control Plan Continuous Activity

7.6 1.11 Repair/rework procedures Based on IPC-7711, 7721 Continuous Activity

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE F-1 - Manual Iron Soldering (Human)

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

Manual Hand Soldering for Mass Production is not recommended, only when touch up and rework are allowed.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 MATERIALS/COMPONENTS

1.1 Components compatible with iron temperature Component Spec Design Review

1.2 Components compatible with solder Component Spec Design Review

1.3 Correct Solder (type/size/core) Per specification Per Control Plan

1.4 Iron tip cleaner Per Control Plan Continuous Activity

2.0 EQUIPMENT

2.1 Air Filters ventilation Per Control Plan Per Preventative Maintenance

Visual identification and

2.2 All tools identified for Pb versus Pb free Continuous Activity
documentation

2.3 Component removal tools

2.4 Correct Tip (shape/size/material) Per specification Per Control Plan

2.5 ESD protection (grounds, pads, straps)

2.6 Ionizers Per Control Plan Per Preventative Maintenance

2.7 Solder iron tip cleaning station

2.8 Solder removal tools

2.9 Soldering Iron Per specification Per Control Plan

2.10 Temperature controller Correct Temperature Continuous Activity

3.0 TOOLS, FIXTURES, PALLETS and JIGS These shall be validated for supporting capacity/volume and quality metrics

3.1 Correct Type for product (Pb/Pb free) Per Control Plan Continuous Activity

4.0 PROCESS WORK INSTRUCTIONS

4.1 Correct Iron Temperature Per specification Quality audit

4.2 ESD Control Per ANSI S20.20 Continuous Activity

4.3 Flux Application (if used) See Process Table F Per specification Per Control Plan

4.4 Iron tip maintenance Proper PM PM Completion Report

4.5 Iron tip temperature calibration Per specification Per Control Plan

4.6 Magazines/Unloading racks (if used) Per Product Specification Per Changeover

4.7 Pb/Pb free changeovers Proper equipment cleaning Per Control Plan Per Changeover

4.8 Pre-heat Process (if used) See Process Table G Per specification Per Control Plan

4.9 Proper Handling of product Per Control Plan Continuous Activity

4.10 Solder Lot Control Bar Code or Manual Per Control Plan
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Visual identification and

4.11 Work stations identified for Pb versus Pb-free material Continuous Activity
documentation

4.12 Work Station Layout Automatic Continuous Activity

5.0 Abnormal Condition Reaction

5.1 Drop part reaction plan Per Control Plan Continuous Activity

5.2 In Process Delay Reaction Plan Per Control Plan Continuous Activity

5.3 Repair/rework procedures Based on IPC-7711, 7721 Continuous Activity

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE G - Laser and Soft Beam Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.3
1.0 1.4 Laser - Soft Beam Solder Equipment
3.1

1.1 1.3 Automated Flux Application See Process Table F

1.2 Manual Flux Application

1.2.1 Correct Flux Type Operator Training Per Training Plan

1.2.2 Correct Applicator Operator Training Per Training Plan

2.11
2.12
1.2.3 Correct Amount and Location Operator Training Per Training Plan

1.2.4 Time

1.3 Conveyor

1.15
1.16
1.3.1 Conveyor width control Per Set-Up Per Control Plan
2.11
2.12

1.3.2 Conveyor speed control Automatic per Control Plan Continuous Activity
2.11
1.3.3 Conveyor infeed cover In place Continuous Activity
2.12
1.4 Pre-heat Process (if used) See Process Table G

1.4
2.11
2.0 Laser Equipment Controls
2.12
3.1
1.4
2.1 Correct Laser Wave Length Per Control Plan Per Specification
2.11

2.2 Correct Laser Power Per Control Plan Per Set-Up Sheet

2.3 Correct Laser Alignment Per Control Plan Per Set-Up Sheet
2.11
2.4 Correct Laser Exposure Time Per Control Plan Per Set-Up Sheet

2.5 Correct Laser Focus (Spot Size) Per Control Plan Per Set-Up Sheet

2.11
3.0 2.12 Soft Beam Equipment Controls
3.1

3.1 Correct Xenon Lamp Per Control Plan Per Specification

3.2 Correct Power Setting Per Control Plan Per Set-Up Sheet

3.3 2.11 Correct Alignment Per Control Plan Per Set-Up Sheet

3.4 Correct Exposure Time Per Control Plan Per Set-Up Sheet

3.5 Correct Focus (Spot Size) Per Control Plan Per Set-Up Sheet

3.6 3.9 ESD Control Per ANSI S20.20 Continuous Activity

3.7 Lead/Lead free changeovers Proper equipment cleaning Per Control Plan Per Changeover

4.0 1.18 Loading/Unloading

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE G - Laser and Soft Beam Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

4.1 1.18 ESD Control Per ANSI S20.20 Continuous Activity

4.2 1.18, 2.6 Proper Handling Operator Training Continuous Activity

4.3 Cooling/Ionizer Blower

4.3.1 Filters presence Per Control Plan Per Preventative Maintenance

4.3.2 1.18 Proper location on conveyor Per Spec/Set-Up Daily Check Sheet

4.3.3 Blower Operation indicator Per Control Plan Daily Check Sheet

4.3.4 Proper maintenance Proper PM PM Completion Report

4.4 Magazines/Unloading racks Per Product Spec Per Changeover

1.18
2.8
4.4.1 Correct Type for product (Pb/Pb free) Per Control Plan Continuous Activity

4.4.2 Correct width and height for product Per Control Plan Continuous Activity
1.18
4.4.3 Correct loading sequence (top down) Per Control Plan Continuous Activity

4.4.4 Covered for transportation and storage Per Control Plan Continuous Activity
1.18
2.8
4.5 Pallet Cleaning Per Control Plan Per Control Plan

1.4
5.0 2.1 Component Compatibility
2.3

5.1 Components compatible with temperature profile Component Spec Design Review
2.1
5.2 Components compatible with solder Component Spec Design Review

1.4
6.0 2.11 Abnormal Condition Reaction
2.12

6.1 2.8 Power failure reaction plan Per Control Plan Continuous Activity

6.2 Emergency-stop reaction plan Per Control Plan Continuous Activity

2.8
6.3 Part jam reaction plan Per Control Plan Continuous Activity
4.4
6.4 Drop part reaction plan Per Control Plan Continuous Activity

6.5 2.8 In Process Delay Reaction Plan Per Control Plan Continuous Activity

6.6 1.11 Repair/rework procedures Based on IPC-7711, 7721 Continuous Activity

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Laser and Soft Beam Soldering (Table G-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process UNITS/WHAT IS COMMENTS

PARAMETER DESCRIPTION FREQUENCY LIMITS /TOLERANCES (RANGE)
Table MONITORED? (CONSEQUENCES)
(2) (4) (5)
(1) (3) (6)

Laser Equipment Controls

Laser Wave Length Nanometers (nm) Continuous Activity (+-X% or +-10 nanometers) Wetting issues, damage PCB

Laser Power Watts Continuous Activity Upon application Depends on the application

Laser Alignment Microns (x,y) Continuous Activity Go No Go Solder issues, damage PCB

Upon application and material used

Laser Exposure Time Milliseconds Continuous Activity Wetting issues, damage PCB
(pyrometer will help with that)

Laser Focus (distance from lense to the smallest (+-1 or 2)

Microns Continuous Activity Wetting issues, damage PCB and melt adjacent components
point of the solder source) Note: it relies on the optic configuration

Spot Size ( the dimension of the laser over the (+-1 or 2)

Microns Continuous Activity Wetting issues, damage PCB and melt adjacent components
surface) Note: it relies on the optic configuration
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE H - Induction Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 Solder Paste Control (Pre-mixed only)
2.12

1.1 Correct solder paste Specification Start-up and Changeover

1.2 Correct storage conditions Specification Continuous Activity

1.6
1.3 Correct stabilization Specification Start-up and Changeover

1.4 Ambient temperature exposure Specification Continuous Activity

1.4
2.0 2.11 Solder Paste Application
2.12

2.1 Dispensed volume Specification Start-up and Changeover

1.6
2.2 Correct dispense location Specification Continuous Activity

2.3 Nozzle condition Per Control Plan Start-up and Changeover

1.4
3.0 2.11 Part Placement
2.12

3.1 Stationary part accuracy Per Set-Up Specification Continuous Activity

3.2 Placement verification Per Set-Up Specification Once per Day

3.3 1.6 Movable part accuracy Per Set-Up Specification Continuous Activity

3.4 Movable part verification Per Set-Up Specification Once per Day

3.5 Gap between parts to be soldered Per Set-Up Specification Once per Day

1.4
4.0 2.11 Equipment Control
2.12

4.1 Power Supply Frequency Per Specification Start-up and Changeover

4.2 Inductive Head Position (Hot Spot position control) Per Specification Start-up and Changeover

4.3 Inductive Head to Part Gap Per Specification Start-up and Changeover

4.4 1.6 Power Profile Per Specification Start-up and Changeover

4.5 Power Duration per Soldering Cycle Per Specification Start-up and Changeover

4.6 Inductive Head Cooling Air Flow Rate Per Specification Start-up and Changeover

4.7 Magnetic Flux Monitoring Per Specification Start-up and Changeover

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE H - Induction Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

1.4
5.0 2.11 Final Inspection
2.12

5.1 1.6 Quality Inspection Audit Per Specification Per Control Plan

5.2 Non-conforming part disposition Reaction plan Per Control Plan

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE H - Induction Soldering Process

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

1.4
6.0 2.11 Loading/Unloading
2.12

6.1 3.9 ESD Control Per ANSI S20.20 Continuous Activity

1.15
6.2 Proper Handling Operator Training Continuous Activity
1.16

6.3 Cooling/Ionizer Blower

6.3.1 Filters presence Per Control Plan Per Preventative Maintenance

6.3.2 1.6 Proper location on conveyor Per spec/set-up Daily Check Sheet

6.3.3 Blower Operation indicator Per Control Plan Daily Check Sheet

6.3.4 1.18 Proper maintenance Proper PM PM Completion Report

6.4 1.6 Magazines/Unloading racks Per Product Specification Per Changeover

6.4.1 Correct Type for product (Pb/Pb free) Per Control Plan Continuous Activity

6.4.2 Correct width and height for product Per Control Plan Continuous Activity

6.4.3 Correct loading sequence (top down) Per Control Plan Continuous Activity

6.4.4 Covered for transportation and storage Per Control Plan Continuous Activity

6.5 Pallet Cleaning Per Control Plan Per Control Plan

1.4
7.0 2.11 Component Compatibility
2.12

7.1 1.6 Components compatible with temperature profile Component Spec Design Review

7.2 1.6 Components compatible with solder Component Spec Design Review

1.4
8.0 2.11 Abnormal Condition Reaction
2.12

8.1 Power failure reaction plan Per Control Plan Continuous Activity

8.2 Emergency-stop reaction plan Per Control Plan Continuous Activity

8.3 2.8 Part jam reaction plan Per Control Plan Continuous Activity

8.4 Drop part reaction plan Per Control Plan Continuous Activity

8.5 In Process Delay Reaction Plan Per Control Plan Continuous Activity

8.6 1.11 Repair/rework procedures Based on IPC-7711, 7721 Continuous Activity

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE I - Press Fit/Compliance Pin

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 1 and 2 MATERIALS/COMPONENTS

Work Orders or Production

1.1 Printed Circuit Board (PCB) Bar Code/DMC Continuous Activity
Schedule Plan, BOM

Work Orders or Production

1.2 2.2 - 2.9 Single and multiple pins/terminals Bar Code/DMC/Manual Continuous Activity
Schedule Plan, BOM

Work Orders or Production

1.3 Connectors/Header Bar Code/DMC/Manual Continuous Activity
Schedule Plan, BOM

Lead Free Control Plan for Press Fit Pins/Terminals (i.e., tin whiskers) Per Documentation Internal Documentation, IPC-9797
1.4 1.6 AABUS
(Size and violation of electrical clearance considerated) Specifications or Customer Driven Specification

1.5 Provide List of Materials (None) N/A N/A N/A

1.6 Provide a List of Consumables (i.e., gloves, wipes, filters) with Per Documentation from
1.6 Internal Documentation Continuous Activity
2.2.-2.9 Manufacturer Specifications, Data Sheet (See Note 1) Manufacturers

1.7 Reels, Tubes, Trays of Electronic/Mechanical components Per Component Specification Internal Documentation Continuous Activity

2.0 1-3 EQUIPMENT

2.1 Servo Press/Travel Force Monitor/Display

2.2 Robotic placement or manual placement with tool / fixture.

1.4
2.10-2.13
3.1-3.3 Inspection System (Visual, tactile, X-Ray, etc.) Per Manufacturers
Equipment Manufacturer
2.3 (Causes to look for pin height, location, contamination, damage, alignment, Recommendations or Internal Continuous Activity
Documentation
etc.), Focusing, Illumination. Maintenance Plan

Per Manufacturers
Equipment Manufacturer
2.4 Vacuum Cleaning System (Optional) Recommendations or Internal Continuous Activity
Documentation
Maintenance Plan

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.5 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
Description)
1.15

Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.6 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers Per number of units

Maintenance Plan Levels - Preventive -
2.7 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
Operator/Technician/Engineering/Manufacturer
1.18 Maintenance Plan related
1.19
With a Maintenance/Calibration Maintenance Internal
2.8 Equipment Manufacturers Maintenance and Calibration Requirements Maintenance/Calibration Schedule
Plan Documentation

Per ANSI/ESD S20.20 or Per ANSI/ESD S20.20 or

2.9 3.9 ESD Control Continuous Activity
IEC 61340-5-3 IEC 61340-5-3

1.4
3.0 2.11 TOOLS, FIXTURES, PALLETS and JIGS These shall be validated for supporting capacity/volume and quality metrics
2.12
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE I - Press Fit/Compliance Pin

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

3.1 Push Tool Per Component Specification Internal Documentation Continuous Activity
1.4
2.10-2.13
3.1-3.3 Per Manufacturers
3.2 Fixture (PCB holder/support) Recommendations or Internal Internal Documentation Continuous Activity
Maintenance Plan

Per Manufacturers Per number of units

1.18 Maintenance Plan Levels - Preventive -
3.3 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
1.19 Operator/Technician/Engineering/Manufacturer
Maintenance Plan related

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

1.2
4.1 1.4 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity
1.6

4.2 Process Control Parameters (PCP) Per product set-up variant Internal Documentation Continuous Activity

3.1
Initial launch of the product and
4.3 PCB - Micro Strain Analysis Per IPC/JEDEC - 9704 PPAP
AABUS

1.2
Initial launch of the product and
4.5 1.4 Qualification of press fit joint (i.e., cross section, contamination) Cross section analysis IPC-9797 or Equivalent
AABUS
1.6

1.7
Internal QA Documentation, PV,
4.6 1.8 SPC Tools (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) SPC internal program Continuous Activity
PPAP, or equivalent
1.9

After any major maintenance (See

4.7 How and when is the push tool, press fit head alignment verified? Set-up per program number Internal Documentation
Note 1 below)
1.2
1.4
1.6
Verification of correct fixture, tool, and software program is used in the Work Orders or Production
4.8 Bar Code/DMC/Manual Continuous Activity
servo press machine. Schedule Plan, BOM

Acceptability Requirements for Servo Press Equipment (MSA for the force Monitoring Product Yields. Internal QA Documentation, PV,
4.9 Continuous Activity
and displacement) See 4.6 for SPC Tools. PPAP, or applicable

1.7 Verification of compliance with IPC-9797, IEC 60352-5, Catalog

4.10 Visual Acceptability Criteria - Manual vs. AOI Continuous Activity
3.2 product requirements Visual Requirements or Equivalent

Verification of compliance with IPC-9797, AOI, Catalog Visual

4.11 MSA for height, alignment for AOI equipment Continuous Activity
product requirements Requirements or Equivalent

1.2
IPC-9797, AOI, Catalog Visual
4.12 1.4 Foreign Object Debris/particulate matter visual criteria Operator Visual Inspection Continuous Activity
Requirements or Equivalent
1.6

1.1 Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
1.5 maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
5.0 PROCESS PERSONNEL PROFICIENCY
1.16 Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
1.17 inspection, or automated inspection (i.e., AOI, AXI).
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE I - Press Fit/Compliance Pin

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

Customer/Supplier/Industry
5.1 1.16 Training Material Used Approved Training, Objective Internal Documentation Continuous activity by supplier
Evidence

Customer/Supplier/Industry
5.2 1.13 On the job training learning curve Approved Training, Objective Internal Documentation Continuous activity by supplier
Evidence

Customer/Supplier/Industry
5.3 1.17 Who are the instructors, (Engineers, Training Department, External) Approved Training, Objective Internal Documentation Continuous activity by supplier
Evidence

Customer/Supplier/Industry
1.1 Instructor Proficiency (based on experience or training) on the Subject
5.4 Approved Training, Objective Internal Documentation Continuous activity by supplier
1.5 Matter
Evidence

5.5 1.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous activity by supplier
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Press Fit (Table I-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process UNITS/WHAT IS LIMITS /TOLERANCES COMMENTS

PARAMETER DESCRIPTION FREQUENCY
Table MONITORED? (RANGE) (CONSEQUENCES)
(2) (4)
(1) (3) (5) (6)

Per Bill of Materials (BOM)

PCB Part Number - Revision Level P/N - Rev Continuous Activity Wrong product processed
and/or Production Schedule

Header/Connector Part Number - Revision Level Per Bill of Materials (BOM)

Component type Continuous Activity Wrong component processed
(conventional press-fit only) and/or Production Schedule

Single Pin Part Number - Revision Level Per Bill of Materials (BOM)
Pin Type Continuous Activity Wrong pin processed
(single-pin insertion only) and/or Production Schedule

Per Bill of Materials (BOM)

Tooling/Comb for Header/Connector/Single Pin Tooling Fixture At Changeover Damage to Header/Connector/Single Pin and/or Printed Board
and/or Production Schedule

Per Bill of Materials (BOM)

Support for Printed Board Support fixture/block At Changeover Damage to Header/Connector/Single Pin and/or Printed Board
and/or Production Schedule

Per process, manufacturers,

Insertion speed mm/s Continuous Activity Damage to Header/Connector/Single Pin and/or Printed Board
and/or customer specifications

Per process, manufacturers,

Push-in Force Newtons Continuous Activity Damage to Header/Connector/Single Pin and/or Printed Board
and/or customer specifications

Pin/Connector/Header Presence Attribute (Yes or No) Continuous Activity Attribute (Yes or No) Missing Pins/Connectors/Headers

Continuous or Per Process Per process, manufacturers, Damage to Header/Connector/Single Pin and/or Printed Board,
Pin Insertion Depth (if inspected) mm
Specification and/or customer specifications Incorrect Pin Height

Continuous or Per Process Per process, manufacturers,

Pin Protrusion (if inspected) mm Bended/Misaligned Pins, Incorrect Header/Pin Position
Specification and/or customer specifications

Continuous or Per Process

Cleanliness: Shavings, Burrs FOD Per IPC-9797, or equivalent FOD, Violation of Electrical Clearance, Shorts
Specification

Sampling Production Inspection of Printed Board and

N/A Per Process Specification Per IPC-9797 Per Workmanship Visual Criteria and Process Requirements
Pin

IPC-9704, Per Process

Strain Measurements on PB Level Microstrain Per Process Specification Damage of sensitive components (i.e., MLCCs, Pad Cratering)
Specification, or Equivalent

Force Gauge Measurement, Travel Distance Force (Newtons), Travel Per Process or Manufacturer
MSA per Documentation Damage to Header/Connector/Single Pin and/or Printed Board
Recording (if applicable) Distance (mm) Specification

Maintenance of Tooling/Support N/A Per Process Specification Per Process Specification Damage to Header/Connector/Single Pin and/or Printed Board

Geometrical Parameters and

Damage to Header/Connector/Single Pin and/or Printed Board,
Release of New Tooling and Support N/A Per Process Specification Strain on PB per Process
Damage of MLCCs, Pad Cratering, etc.
Specification
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE J - Contamination Control

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 MATERIALS/COMPONENTS

2.9 Work Orders or Production

1.1 PCAs (Assemblies) Bar Code/DMC/Manual Continuous Activity
2.10 Schedule Plan

1.2 Test Solution/Extraction Fluid Bar Code/DMC/Manual Work Instructions Maintenance Schedule
2.4
1.3 Gloves for Handling PCBs (Board Blanks) Manual Work Instructions Maintenance Schedule
2.9
1.4 Calibration Solution Manual Work Instructions Maintenance Schedule

2.0 EQUIPMENT/TOOLS

2.1 Automated Measurement Equipment for Ionic Residues

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.1.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
1.18 Description)
3.2
3.10
Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
Training, Critical Spare Parts) Section 3.0 below

2.2 Hydrometer (if applicable/required)

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.2.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
1.18 Description)
3.2
3.10
Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.2.2 Per Documentation Available for review
Training, Critical Spare Parts) Section 3.0 below

3.0 PROCESS WORK INSTRUCTIONS

3.1 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity

The PCP are a reflection of the

equipment, components and
materials used which results in
3.2 1.3 Process Control Parameters (PCP) for Test Procedure See Internal Documentation Work Instructions
meeting the acceptability
requirements for that specific
process step.

2.9
3.2.1 Temperature of Test Solution Automatic Work Instructions Continuous Activity
2.12

3.2.2 2.12 Conductivity of Test Solution Prior to Test Automatic Work Instructions Continuous Activity

3.2.3 Recirculating Pump Power Automatic Work Instructions Continuous or at Maintenance

1.4
3.2.4 Test time Automatic Work Instructions Continuous Activity
1.6

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
4.0 PROCESS PERSONNEL PROFICIENCY
Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
inspection, or automated inspection (i.e., AOI, AXI).
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021
Customer/Supplier/Industry
4.1 Training Material Used Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
4.2 On the job training learning curve Approved Training, Objective Internal Documentation Continuous Activity
Evidence
1.16
Customer/Supplier/Industry
4.3 Who are the instructors, (Engineers, Training Department, External) Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
Instructor Proficiency (based on experience or training) on the Subject
4.4 Approved Training, Objective Internal Documentation Continuous Activity
Matter
Evidence

4.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or IEC

5.0 3.9 ESD Equipment/Personnel Grounded Continuous Activity
Requirements 61340-5-3

Per CQI-17, Section 1.6. Other

6.0 2.3 Traceability Control Internal Documentation Continuous Activity
Requirements
2.4 Per CQI-17, Section 1.6. Other
7.0 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
2.9 Requirements
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Contamination Control (Table J-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process LIMITS /TOLERANCES COMMENTS

PARAMETER DESCRIPTION UNITS/WHAT IS MONITORED? FREQUENCY
Table (RANGE) (CONSEQUENCES)
(2) (3) (4)
(1) (5) (6)

Ionic Residue

Product Name Profile N/A Continuous Activity N/A Wrong product selection

Per Bill of Materials (BOM)

PCB Part Number - Revision Level N/A Continuous Activity Wrong product analyzed
and/or Monitoring Schedule

Test solution/extraction fluid N/A At maintenance Per Work Instructions Erroneous results

Calibration solution N/A At maintenance Per Work Instructions Erroneous results

Temperature of Test Solution deg. C Continuous Activity Per Work Instructions Erroneous results

Per Internal Documentation,

Conductivity of Test Solution Prior to Test (PCB and
µgrams/cm square Continuous Activity IPC-6012 (PCB Level), J-STD- Erroneous results
PCA level)
001 (PCA Level)

Recirculating Pump Power % or flow rate Continuous Activity Per Work Instructions Erroneous results

Test time s Continuous Activity Per Work Instructions Erroneous results

Manufacturing Facility Environmental Air Internal Documentation or

Number of particles and size As determined by the results Intermittent or inoperative (Reliability Issue)
Contamination equivalent industry standard

Number of particles, size and type Internal Documentation/5S

Workstation/Fixture Contamination Continuous Activity Intermittent or inoperative (Reliability Issue)
(conductive/nonconductive) System
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE K - Conformal Coating and Inspection

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 MATERIALS/COMPONENTS
2.12

Work Orders or Production

1.1 1.6 Printed Circuit Board (PCA) Bar Code/DMC Continuous Activity
Schedule Plan, BOM

Provide List of Materials (i.e., solvents/cleaner, coatings) with Manufacturer Per Documentation from Per Documentation from
1.2 Continuous Activity
Specifications, Data Sheet Manufacturers Manufacturers

2.2
Per Documentation from
2.6 Shelf life, warehouse/in-process storage conditions, operating conditions Per Documentation from
1.2.1 Manufacturers, consult IPC-HDBK- Continuous Activity
2.8 (i.e., viscosity). (Follow original manufacturers specification) Manufacturers
830
2.9
Provide a List of Consumables (i.e., gloves, wipes, operator safety gear,
Per Documentation from
1.3 filters) with Manufacturer Specifications, Data Sheet Internal Documentation Continuous Activity
Manufacturers
(See Note 1)

2.0 EQUIPMENT

3.10
2.1 Dispensing system
3.11

2.1.1 Curing System (i.e., heat, ambient, UV)

3.8
2.1.2 Black Light Inspection System

3.10
2.1.3 Cleaning System (i.e., conveyor, nozzles, fixtures)
3.11

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.2 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
Description).
1.15

Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.2.1 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers Per number of units

Maintenance Plan Levels - Preventive -
2.2.2 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
Operator/Technician/Engineering/Manufacturer (self-cleaning)
Maintenance Plan related
1.18
1.19
Maintenance Internal
2.2.3 Equipment Manufacturers Maintenance and Calibration Requirements Maintenance/Calibration Plan Maintenance/Calibration Schedule
Documentation

1.4
3.0 2.11 TOOLS, FIXTURES, PALLETS and JIGS These shall be validated for supporting capacity/volume and quality metrics
2.12

3.1 Component covers Per component specification Internal Documentation Continuous Activity

2.11 Per Manufacturers

3.2 2.12 Fixture (PCB holder/support) with keep out zones Recommendations or Internal Internal Documentation Continuous Activity
2.13 Maintenance Plan

Per Manufacturers Per number of units

1.18 Maintenance Plan Levels - Preventive -
3.3 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
1.19 Operator/Technician/Engineering/Manufacturer
Maintenance Plan related

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

4.1 2.11 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity
2.12
2.13
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE K - Conformal Coating and Inspection

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
2.11 (How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action
2.12
2.13
4.2 Process Control Parameters (PCP) Per product set-up variant Internal Documentation Continuous Activity

1.7
2.11 Internal QA Documentation, PV,
4.2.1 SPC Tools (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) SPC internal program Continuous Activity
2.12 PPAP, or equivalent.
2.13

IPC-A-610, J-STD-001, (610/001

Automotive Addendum) IPC-
Verification of compliance with
4.3 Visual Acceptability Criteria - Manual (with Black Light) vs. ACI/AOI HDBK-830 (Section 4.0, 8.1), Continuous Activity
product requirements.
Catalog Visual Requirements or
Equivalent

IPC-A-610, J-STD-001, (610/001

3.8 Automotive Addendum) IPC-
MSA for conformal coating coverage for ACI/AOI with Black Light Verification of compliance with
4.3.1 HDBK-830 (Section 4.0, 8.1), Continuous Activity
equipment product requirements.
Catalog Visual Requirements or
Equivalent

Conformal Coating thickness (impact on maximum/minimum limits (i.e., Verification of compliance with Internal Documentation, PVs,
Initial launch of the product and
4.3.2 curing, component breakage, components exposed, component terminals the impact of maximum and Process Parameters Study
AABUS
end) minimum thickness limits. Analysis (See L-1 Table) (DOE)

Personnel Proficiency All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
1.4
maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
5.0 2.11 PROCESS PERSONNEL PROFICIENCY
Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
2.12
inspection, or automated inspection (i.e., AOI, AXI).

Customer/Supplier/Industry
5.1 Training Material Used Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
5.2 On the job training learning curve Approved Training, Objective Internal Documentation Continuous Activity
Evidence
2.8
Customer/Supplier/Industry
5.3 Who are the instructors (Engineers, Training Department, External) Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
Instructor Proficiency (based on experience or training) on the Subject
5.4 Approved Training, Objective Internal Documentation Continuous Activity
Matter
Evidence

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

1.17
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - Conformal Coating (Table K-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process UNITS/WHAT IS LIMITS /TOLERANCES COMMENTS

PARAMETER DESCRIPTION FREQUENCY
Table MONITORED? (RANGE) (CONSEQUENCES)
(2) (4)
(1) (3) (5) (6)

Conformal Coating

Type Used: Conformal Type Error-Proofing Check Sheet Per Specification Wrong product selection (Acrylic, Epoxy, Silicone, Polyurethane etc.)

Curing Method: Type of Curing Method Error-Proofing Check Sheet Per Specification Wrong method selection (Heat, UV, Ambient, Humidity cure etc.)

Preparation

Pre-Mixed:

°C, °F, % Humidity, Erroneous results, applied thickness could be impacted, possible change in
Correct Storage Conditions Continuous Activity Per Specifications
Closed/Sealed specific gravity impacting Ionic contamination

Stabilized to operating temperature °C, °F Check sheet Per Specifications Erroneous results

Correct Material Per Conformal Type Every Container Bar Code or Manual Wrong product selection, poor reliability

Expiration Date/Lot Control Per Container information Every Container Bar Code or Manual Erroneous results, poor adhesion and reliability issues

Expired Material Handling Per Container information Per Control Plan Per Control Plan Erroneous results, poor adhesion and reliability issues

On-site Mixed:

°C, °F, % Humidity, Erroneous results, applied thickness could be impacted, possible change in
Correct Storage Conditions for Components Per Control Plan Per Specifications
Closed/Sealed specific gravity impacting Ionic contamination

Correct mixing temperature °C, °F, % Humidity Check sheet Per Specifications Erroneous results

Correct Material Conformal Type Every Container Bar Code or Manual Erroneous results

Ingredient Expiration Date/Lot Control Per Container information Every Container Bar Code or Manual Erroneous results, poor adhesion and reliability issues

Expired ingredients handling Per Container information Per Control Plan Per Control Plan Erroneous results, poor adhesion and reliability issues

Mixing tools calibrated N/A Per Calibration Cycle Per Control Plan Erroneous results

Per Control Plan/Work

Cleanliness of mixing containers and work area N/A No foreign materials Cleaning, residues issues
Instructions

Mixing time seconds, minutes Check sheet Per Specifications Erroneous results

Viscosity confirmation poise, reyn Check sheet Per Specifications Erroneous results

Prepared conformal coating expiration date Per Container information Check sheet Per Specifications Erroneous results, poor adhesion and reliability issues

Coating Application

Spray - Automatic or Manual

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Correct Coverage Area in2, cm2 Set-up Sheet Per Specification Erroneous results

No Coating/Overspray In Exclusion Zone N/A Set-up Sheet Per Specification Erroneous results, intermittent function if in wrong location (i.e., female terminal)

Correct Thickness/Uniformity microns Set-up Sheet Per Specification Erroneous results, latent delamination or reliability concerns

Solution Flow Rate (if 3.1.3 not applicable) cm3/s, in3/s Set-up Sheet Per Control Plan Erroneous results, impact thickness parameters

Solution Pressure Rate psi, Pa Set-up Sheet Per Control Plan Erroneous results, impact thickness parameters

Nozzle Movement Speed mm/s, in/s Set-up Sheet Per Control Plan Erroneous results

Per Preventive Maintenance

Nozzle Maintenance N/A Maintenance Check Sheet Erroneous results, impact thickness parameters, and potential reliability concerns
Schedule

Masking (Manual Spray Only) dimensional location (mm) Continuous Activity Per Specification Erroneous results

Board and Solution Temperature °C, °F Continuous Activity Per Product Specification Erroneous results

Dip - Automatic or Manual

Correct Coverage Area in2, cm2 Set-up Sheet Per Specification Noncompliance to materials requirements

Per Specification and Control

Correct Thickness/Uniformity microns Set-up Sheet Erroneous results
Plan

PM Schedule per customer

No Foreign Material in Pot N/A Proper Filtering Erroneous results
requirement

Uniform viscosity maintenance N/A Set-up Sheet Per Product Specification Erroneous results

Insert and Withdraw Rate/Soak Time seconds, minutes Set-up Sheet Per Control Plan Erroneous results

Correct board orientation N/A Continuous Activity Per Specification Erroneous results

Board and Tank Temperature °C, °F Continuous Activity Per Product Specification Erroneous results

Drip Time seconds, minutes Continuous Activity Per Product Specification Erroneous results

Brush Not Recommended

Correct Brush Type Conformal Type Set-up Sheet Per Specification Erroneous results, contamination

Correct Coverage Area in2, cm2 Set-up Sheet Per Specification Erroneous results, high variability in process.

No Coating/Oversplash In Exclusion Zone N/A Set-up Sheet Per Specification Erroneous results, high variability in process.

Correct Thickness/Uniformity microns Set-up Sheet Per Specification Erroneous results, high variability in process.

Masking (if Required) N/A Continuous Activity Per Specification Erroneous results, high variability in process.

Uniform viscosity maintenance poise, reyn Set-up Sheet Per Product Specification Erroneous results, high variability in process.

No Foreign Material in Pot N/A Set-up Sheet Per Specification Erroneous results, high variability in process, increased contamination on PCB

Board and Tank Temperature °C, °F Continuous Activity Per Product Specification Erroneous results

Proper ESD Control Volts Continuous Activity Per ANSI S20.20 Erroneous results, early reliability concerns with unknown ESD

Selective Coverage Area Erroneous results

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

Correct Coverage Area in2, cm2 Set-up Sheet Per Specification Erroneous results

No Coating/Drips In Exclusion Zone N/A Set-up Sheet Per Specification Erroneous results

Board and Solution Temperature °C, °F Continuous Activity Per Product Specification Erroneous results
Proper Coverage for Manual Applications with
in , cm
2 2
Visual Control Proper Operator Training Erroneous results
controls as above
Curing

Ultra Violet (UV) Cure

Proper UV Source W/m2, nm Set-up Sheet Per Specification Erroneous results

Proper Exposure Time seconds, minutes Set-up Sheet Per Specification Erroneous results, early reliability concerns

Debris Control N/A Set-up Sheet Per Specification Erroneous results

Correct Orientation N/A Continuous Activity Per Specification Erroneous results

Per Preventive Maintenance

Proper UV Source Maintenance N/A Maintenance Check Sheet Erroneous results
Schedule

Plant Level:
Humidity Control %H Per Coating Specifications Erroneous results
Equipment Level:

Humidity Cure %H Erroneous results

Correct Temperature/Humidity Range °C, °F, %Humidity Set-up Sheet Per Specification Erroneous results

Proper Exposure Time seconds, minutes Set-up Sheet Per Specification Erroneous results, early reliability concerns

Debris Control N/A Set-up Sheet Per Specification Erroneous results

Correct Orientation N/A Continuous Activity Per Specification Erroneous results

Heat Cure

Correct Temperature Level °C, °F Set-up Sheet Per Specification Erroneous results, early reliability concerns

Proper Exposure Time seconds, minutes Set-up Sheet Per Specification Erroneous results, early reliability concerns

Debris Control N/A Set-up Sheet Per Specification Erroneous results

Correct Orientation N/A Continuous Activity Per Specification Erroneous results

Proper Humidity Level %H Continuous Activity Per Specification Erroneous results

Ambient Cure

Correct Temperature/Humidity Range °C, °F, %Humidity Set-up Sheet Per Specification Erroneous results, early reliability concerns

Proper Cure Time seconds, minutes Set-up Sheet Per Specification Erroneous results, early reliability concerns

Debris Control N/A Set-up Sheet Per Specification Erroneous results

Correct Orientation N/A Continuous Activity Per Specification Erroneous results

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE L - PCA Separation (Depaneling/Routing)

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 MATERIALS/COMPONENTS
2.12

Work Orders or Production

1.1 1.6 Printed Circuit Board (PCA) Bar Code/DMC Continuous Activity
Schedule Plan, BOM

1.2 2.2 Provide List of Materials (None) N/A N/A N/A

2.6
2.8 Provide a List of Consumables (i.e., router bits, blades, filters) with Per Documentation from
1.3 2.9 Internal Documentation Continuous Activity
Manufacturer Specifications, Data Sheet Manufacturers

2.0 EQUIPMENT

3.9
2.1 3.10 Depaneling System (Router, laser, blade cutter)
3.11

2.1.1 3.8 Vacuum System

3.9
2.2 3.10 Air de-ionizer (Coming with the depaneling system or added). Per component specification Internal Documentation Continuous Activity
3.11

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.3 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
Description)
1.15
Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.3.1 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers Per number of units

Maintenance Plan Levels - Preventive -
2.3.2 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
Operator/Technician/Engineering/Manufacturer (self-cleaning)
1.18 Maintenance Plan related
1.19
With a Maintenance/Calibration Maintenance Internal
2.3.3 Equipment Manufacturers Maintenance and Calibration Requirements Maintenance/Calibration Schedule
Plan Documentation

1.4
3.0 2.11 TOOLS, FIXTURES, PALLETS and JIGS These shall be validated for supporting capacity/volume and quality metrics
2.12

Per Manufacturers
Fixture (PCB holder/support) with/without keep out zones, to avoid
3.1 2.10-2.13 Recommendations or Internal Internal Documentation Continuous Activity
contamination
Maintenance Plan

Per Manufacturers Per number of units

1.18 Maintenance Plan Levels - Preventive -
3.2 Recommendations or Internal Maintenance Plan Documentation produced/ran/cycles, or time period
1.19 Operator/Technician/Engineering/Manufacturer
Maintenance Plan related

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

4.1 Provide Written Work Instructions and Process Flow Chart Per Documentation Internal Documentation Continuous Activity
2.10-2.13
4.2 Process Control Parameters (PCP) Per product set-up variant Internal Documentation Continuous Activity

1.7 Internal QA Documentation, PV,

4.2.1 SPC Tools (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) SPC internal program Continuous Activity
2.10-2.13 PPAP, or equivalent

Initial launch of the product and

4.3 PCA - Micro Strain Analysis Per IPC/JEDEC - 9704 PPAP
AABUS

3.8
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE L - PCA Separation (Depaneling/Routing)

All requirements given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

Verification of correct fixture, router bit, laser power and software program Work Orders or Production
4.4 Bar Code/DMC/Manual Continuous Activity
is used in the depaneling system. Schedule Plan, BOM
3.8
Semi-Automatic the frequency is
IPC-A-610, J-STD-001, (610/001 Continuous activity. For fully
Verification of compliance with
4.5 Visual Acceptability Criteria Automotive Addendum), Catalog automated only at initial set-up,
product requirements
Visual Requirements or Equivalent shift start up, change-overs and
maintenance.

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
1.4
maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
5.0 2.11 PROCESS PERSONNEL PROFICIENCY
Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
2.12
inspection, or automated inspection (i.e., AOI, AXI).

Customer/Supplier/Industry
5.1 Training Material Used Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
5.2 On the job training learning curve Approved Training, Objective Internal Documentation Continuous Activity
Evidence
2.8
Customer/Supplier/Industry
5.3 Who are the instructors, (Engineers, Training Department, External) Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
Instructor Proficiency (based on experience or training) on the Subject
5.4 Approved Training, Objective Internal Documentation Continuous Activity
Matter
Evidence

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

Documented, coordinated by
5.6 1.17 Technical Support Levels (Engineering, Technicians, Operator) Internal Documentation Continuous Activity
Human Resources

Determined by the job Internal Documentation or Industry

5.6.1 Technical Support Level - Knowledge Required per Level Continuous Activity
requirements Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or IEC

6.0 3.9 ESD Equipment/Personnel Grounded Continuous Activity
Requirements 61340-5-3

Per CQI-17, Section 1.6. Other

7.0 4.4 Traceability Control Internal Documentation Continuous Activity
Requirements
Per CQI-17, Section 1.6. Other
8.0 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements

Depanelized/Routed PCAs shall be stored in ESD/FOD free approved

8.1 2.3, 2.7 Continuous Activity
containers

9.0 Other

9.1 1.1 No hand/manual PCA Separation permitted otherwise AABUS

CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS PARAMETERS GUIDELINES - PCA Separation (Table L-1)

All guidelines given below are subordinate to customer written specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer/supplier written specific requirements.

Process UNITS/WHAT IS COMMENTS

PARAMETER DESCRIPTION FREQUENCY LIMITS /TOLERANCES (RANGE)
Table MONITORED? (CONSEQUENCES)
(2) (4) (5)
(1) (3) (6)

Milling Machine

Product Name Profile N/A Continuous Activity N/A Wrong product selection

Per Bill of Materials (BOM) and/or

PCB Part Number - Revision Level N/A Continuous Activity Wrong product selection
Monitoring Schedule

Per Bill of Materials (BOM) and/or

Tooling for Panels N/A Continuous Activity Damaged PCB
Monitoring Schedule

Per Bill of Materials (BOM) and/or

Tooling for individualized PCBs N/A Continuous Activity Damaged PCB
Monitoring Schedule

Per Bill of Materials (BOM) and/or Damaged PCB, excessive strain and damage of strain-sensitive components,
Milling Bit N/A At Changeover
Work Instructions o.e. MLCCs, Pad Cratering, etc.

RPM Rev./s At Changeover Per Work Instructions Damaged PCB

Milling Speed mm/s Continuous Activity Per Work Instructions Damaged PCB

Vacuum - Power and vacuum tubing N/A At Changeover Per Work Instructions PCBs contaminated with dust/FOD

Ionizer - efficiency N/A Per Process Specification Per Work Instructions Damage of ESD-sensitive components

ESD-safe operation N/A Per Process Specification Per Work Instructions Damage of ESD-sensitive components

IPC-9704, Per Process Specification,

Strain Measurement on PB Level Microstrain Per Process Specification Damage of sensitive components (i.e., MLCCs, Pad Cratering)
or Equivalent

Frequency spectrum,
Oscillation Measurement on PB Level Per Process Specification Per Work Instructions Damage of vibration-sensitive components (i.e., micro-mechanical sensors)
acceleration
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE M - In-Circuit Testing (ICT)

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer requirements.
Scope of ICT = to check for shorts, wrong components, missing components, polarity.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 MATERIALS/COMPONENTS
2.12

Work Orders or Production

1.1 1.6 Printed Circuit Assembly (PCA) Bar Code/DMC Continuous Activity
Schedule Plan, BOM

1.2 2.2 Provide List of Materials (None) N/A N/A N/A

2.6
2.8 Provide List of Consumables (i.e., wipes, probes) with Manufacturer Per Documentation from
1.3 2.9 Internal Documentation Continuous Activity
Specifications, Data Sheet (See Note 1) Manufacturers

2.0 EQUIPMENT

3.9
Depends on ICT coverage Equipment Manufacturer
2.1 3.10 In-Circuit Tester (ICT) Available for Review
requirements Documentation
3.11

Equipment Manufacturer Specifications

Equipment Manufacturer
2.1.1 (i.e., Operations Manual, Maintenance, Training, Critical Spare Parts, Per Documentation Available for Review
Documentation
Process Control Parameters Description)
1.15
Internal Equipment Specifications See Process Work Instructions
2.1.2 Per Documentation Available for Review
(i.e., Operations Manual, Maintenance, Training, Critical Spare Parts.) Section 4.0 below

Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units tested, or time
2.1.3 Recommendations or Internal Maintenance Plan Documentation
1.19 Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

2.2 1.7 Process EOL stability check Semi-Automatic Internal Documentation Monthly or AABUS

1.18
2.3 Equipment Manufacturers PM and Calibration Requirements With a PM/Calibration Plan PM Internal Documentation PM/Calibration Schedule
1.19

Software Test Applications (test program) Using the BOM per product ICT Test Coverage List (Document
2.4 Continuous Activity
(This software is used to accomplish the scope of ICT Testing) type why is and not covered)

2.5 System Flash Programmers Automatic Product Test Specification Start of NPI or revisions changes

1.4
3.0 2.11 TOOLS, FIXTURES,PALLETS, JIGS
2.12

Validation Process Documentation

Start of NPI (Paint Test, Strain
(Paint test (damage components),
3.1 2.13 PCB Pallet or Test Fixture (Bed of Nails/Pins) Per Mechanical Drawing/BOM Gauge), Yearly or AABUS (GR&R).
Strain GAUGE, GR&R)
Paint Test as Failures Justify It
See IPC-9704

Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units tested, or time
3.2 Recommendations or Internal Maintenance Plan Documentation
1.19 Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

2.10 Per component specification

4.1 Process Control Parameters (PCP) Product Test Specification Continuous Activity
2.13 limits

Internal QA Documentation, PV,

4.1.1 SPC Tools (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) SPC internal program Continuous Activity
PPAP or equivalent
1.9
2.13
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE M - In-Circuit Testing (ICT)

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer requirements.
Scope of ICT = to check for shorts, wrong components, missing components, polarity.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action
1.9
2.13
Internal QA Documentation, PV,
4.2 Acceptability Requirements for ICT Monitoring Product Yields Continuous Activity
PPAP or applicable

4.2.1 Handling/Routing of Physical ICT Failures Automatic/Manual Internal Documentation As Failures Occur
2.3
4.2.2 Handling/Routing of ICT Data Failures Automatic/Manual Internal Documentation As Failures Occur
2.4
4.2.3 Handling/Routing - Analysis/Debugging ICT Failures Semi-Automatic Internal Documentation As Failures Occur

With or without Magnification

4.2.3.1 3.8 Visual Inspection - Failure confirmation Aids (See IPC-A-610 Section Internal Documentation As Failures Occur
1.0), or equivalent

1.6
4.3 Process Flow Chart, Work Instructions See Section F.6. Internal Documentation Continuous Activity
1.15

Test Coverage Matrix from ICT,

Initial validation/launch and after
4.4 Component Test Coverage AOI, J-TAG Boundary Scan , Internal Documentation
design changes
AXI, EOL, Visual

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
1.4
maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
5.0 2.11 PROCESS PERSONNEL PROFICIENCY
Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
2.12
inspection, or automated inspection (i.e., AOI, AXI).

Customer/Supplier/Industry
5.1 Training Material Used Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
5.2 On the job training learning curve Approved Training, Objective Internal Documentation Continuous Activity
Evidence
2.8
Customer/Supplier/Industry
5.3 Who are the instructors, (Engineers, Training Department, External) Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
Instructor Proficiency (based on experience or training) on the Subject
5.4 Approved Training, Objective Internal Documentation Continuous Activity
Matter
Evidence

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

1.17
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE N - Functional Testing (EOL)

All requirements given below are subordinate to customer specific requirements.

The customer may have additional requirements, e.g., inspection testing, greater frequencies.
When performing the job audit, the auditor shall verify Assembly/Manufacturing/Soldering Organization is conforming to customer requirements.
Scope of Functional Testing (EOL) = to confirm the electrical function of the device under test (DUT).

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.4
1.0 2.11 MATERIALS/COMPONENTS
2.12

Work Orders or Production

1.1 1.6 Module Assembly Bar Code/DMC Continuous Activity
Schedule Plan, BOM

1.2 Provide List of Materials (None) N/A N/A N/A

2.2
2.6
2.8 Provide a List of Consumables (i.e., wipes, probes) with Manufacturer Per Documentation from
1.3 2.9 Internal Documentation Continuous Activity
Specifications, Data Sheet (See Note 1) Manufacturers

2.0 EQUIPMENT

3.9
Depends on Functional Testing Equipment Manufacturer
2.1 3.10 Functional Test Station (EOL) Available for review
coverage requirements Documentation
3.11

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.1.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
Description)
1.2
Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units tested, or time
2.1.3 Recommendations or Internal Maintenance Plan Documentation
1.19 Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

2.2 1.7 Process EOL stability check Semi-Automatic Internal Documentation Monthly or AABUS

1.18
2.3 Equipment Manufacturers PM and Calibration Requirements With a PM/Calibration Plan PM Internal Documentation PM/Calibration Schedule
1.19

Software Test Applications (Firmware) (This software is used to accomplish Using the BOM per product ICT Test Coverage List (Document
2.4 Continuous Activity
the scope of EOL Testing) type why is and not covered)

2.5 System Flash Programmers Automatic Product Test Specification Start of NPI or revisions changes

1.4
3.0 2.11 TOOLS, FIXTURES, PALLETS, JIGS
2.12

Validation Process Documentation Start of NPI or AABUS (STRAIN

Mechanical Fixture with access to the main connector and peripherals used Per Mechanical Drawing/STP
3.1 2.13 (Strain GAUGE, GR&R). GAUGE), yearly or AABUS
by customer like antennas, USB, Ethernet. files
See IPC-9704 (GR&R)

Per Manufacturers
1.18 Maintenance Plan Levels - Preventive - Per number of units tested, or time
3.2 Recommendations or Internal Maintenance Plan Documentation
1.19 Operator/Technician/Engineering/Manufacturer related
Maintenance Plan

1.4
4.0 2.11 PROCESS WORK INSTRUCTIONS
2.12

2.10
4.1 Test Specification Per Product Specification Product test Specification (PTS) Continuous Activity
2.13

Internal QA Documentation, PV,

4.1.1 SPC Tools (i.e., Cpk, KPC, KCC, PPM, DPMO, Yields) SPC internal program Continuous Activity
PPAP or equivalent
1.9
2.13
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
1.9 Version 2, August 2021
2.13
Internal QA Documentation, PV,
4.2 Acceptability Requirements for Functional Test Monitoring Product Yields Continuous Activity
PPAP or applicable

4.2.1 Handling/Routing of Physical Functional Testing Failures Automatic/Manual Internal Documentation As Failures Occur

2.3
4.2.2 Handling/Routing of Functional Testing Data Failures Automatic/Manual Internal Documentation As Failures Occur
2.4

4.2.3 Handling/Routing - Analysis/Debugging Functional Testing Failures Semi-Automatic Internal Documentation As Failures Occur

With or without Magnification

4.2.3.1 3.8 Visual Inspection - Failure confirmation Aids (See IPC-A-610 Section Internal Documentation As Failures Occur
1.0), or equivalent

1.6 Per CQI-17, Section 1.6. Other

4.3 Process Flow Chart, Work Instructions Internal Documentation Continuous Activity
1.15 Requirements

Test Coverage Matrix from ICT,

Initial validation/launch and after
4.4 Component Test Coverage AOI, J-TAG Boundary Scan , Internal Documentation
design changes
AXI, EOL, Visual

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
1.4
maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
5.0 2.11 PROCESS PERSONNEL PROFICIENCY
Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
2.12
inspection, or automated inspection (i.e., AOI, AXI).

Customer/Supplier/Industry
5.1 Training Material Used Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
5.2 On the job training learning curve Approved Training, Objective Internal Documentation Continuous Activity
Evidence
2.8
Customer/Supplier/Industry
5.3 Who are the instructors, (Engineers, Training Department, External) Approved Training, Objective Internal Documentation Continuous Activity
Evidence

Customer/Supplier/Industry
Instructor Proficiency (based on experience or training) on the Subject
5.4 Approved Training, Objective Internal Documentation Continuous Activity
Matter
Evidence

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

Documented, coordinated by
5.6 1.17 Technical Support Levels (Engineering, Technicians, Operator) Internal Documentation Continuous Activity
Human Resources

Determined by the job Internal Documentation or Industry

5.6.1 Technical Support Level - Knowledge Required Continuous Activity
requirements Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or IEC

6.0 3.9 ESD Equipment/Personnel Grounded Continuous Activity
Requirements 61340-5-3

Per CQI-17, Section 1.6. Other

7.0 2.1 - 2.3 Traceability Control Internal Documentation Continuous Activity
Requirements

2.3, 2.4, Per CQI-17, Section 1.6. Other

8.0 Product Handling - Loading/Unloading Internal Documentation Continuous Activity
2.7, 2.8 Requirements

9.0 Other

Note 1: Shall provide documentation how Lead vs. Lead free are segregated.
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE O - Rework (Removal/Replacement and Touch-up)

All requirements given below are subordinate to customer specific requirements. Rework, Repair and Touch-up shall be As Agreed Between User and Supplier (AABUS).

The customer may have additional requirements, e.g., inspection testing, greater frequencies. When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

1.0 MATERIALS/COMPONENTS On-line Rework

Provide List of Materials (i.e., flux, solder, cleaner, coatings) with Per Documentation from
1.1 Internal Rework Documentation Continuous Activity
Manufacturer Specifications, Data Sheet (See Note 1) Manufacturers
1.4
2.11 Provide a List of Consumables (i.e., gloves, wipes) with Manufacturer Per Documentation from
1.2 2.12 Internal Rework Documentation Continuous Activity
Specifications, Data Sheet (See Note 1) Manufacturers

1.3 Control of correct replacement spare parts Manual or Automated Internal Rework Documentation Continuous Activity

2.0 EQUIPMENT

Provide list of equipment, Brand, Model, etc. Equipment Manufacturer

2.1 Per Documentation Available for review
(See Note 1 below). Documentation

Equipment Manufacturer Specifications (i.e., Operations Manual,

Equipment Manufacturer
2.1.1 Maintenance, Training, Critical Spare Parts, Process Control Parameters Per Documentation Available for review
Documentation
Description)
1.18
1.19
Internal Equipment Specifications (i.e., Operations Manual, Maintenance, See Process Work Instructions
2.1.2 Per Documentation Available for review
Training, Critical Spare Parts) Section 4.0 below

Maintenance Plan Levels - Preventive - Per Manufacturers Recommendations Per number of units reworked, or
2.1.3 Maintenance Plan Documentation
Operator/Technician/Engineering/Manufacturer or Internal Maintenance Plan time related

3.0 TOOLS, FIXTURES, PALLETS, and JIGS

Provide list of fixtures, pallets, and jigs by component type

3.1 By providing a list Internal Documentation
(See Note 1 below)
1.18
1.19
Maintenance Plan Levels - Preventive - Per Manufacturers Recommendations Per number of units reworked, or
3.2 Maintenance Plan Documentation
Operator/Technician/Engineering/Manufacturer or Internal Maintenance Plan time related

Reworked assemblies (PCAs) shall achieve the quality of the original product. No rework permitted without initial Process Validation (PV) results on file from the reworked process. The Goal is to have zero rework
4.0 PROCESS WORK INSTRUCTIONS
processes, demonstrating continuous improvement. It should be used only under critical situations and it is required to identify and document if it is design, material, or process related issue.

Per component manufacturer

4.1 Process Control Parameters (PCP) Rework Instructions Continuous Activity
guidelines/restrictions

SPC Tools (i.e., Cpk, Ppk, KPC, KCC, PPM, DPMO, Yields) Internal QA Documentation, PV,
4.1.1 SPC internal program Continuous Activity
See Section 1.6 Other Requirements, Item 4.c PPAP or equivalent.

Process Flow Chart of Reworked Units - Data Information + Physical

4.2 Per PCA Part Number. Per Internal Rework Instructions Continuous Activity
Movement, WIP Storage

Per J-STD-001 SECTION 13.0

Rework and Repair, Internal
Rework Instructions, IPC-7711-
4.2.1 Rework Instructions by Part Number (See Note 2} Per PCA Part Number. Continuous Activity
7721 Section I and II,
Component/Material
Recommendations

4.2.1.1 Disposition of replaced components Disposition procedures Per Internal Rework Instructions Continuous Activity

1.6
1.15
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE O - Rework (Removal/Replacement and Touch-up)

All requirements given below are subordinate to customer specific requirements. Rework, Repair and Touch-up shall be As Agreed Between User and Supplier (AABUS).

The customer may have additional requirements, e.g., inspection testing, greater frequencies. When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

Bill Of Materials (BOM) (List of Components Reworkable vs. Non-

4.2.1.2 AABUS Per Internal Rework Instructions Continuous Activity
1.6 reworkable and Customer Allowed vs. Non-allowed)
1.15

As part of how it is done, it shall be

stated the rework
verification/compliance process to
ensure that the rework was performed Internal Rework Instructions. See
4.3 Acceptability Requirements for Reworked Units Continuous Activity
according to the process control Section 1.6 Other Requirements
parameters and testing requirements
and how it is re-integrated and tracked
back into the normal process flow.

Verification of rework is compliant with IPC-A-610, AOI Catalog Visual

4.3.1 Visual Acceptability Criteria - Human vs. AOI Continuous Activity
product requirements Requirements or Equivalent

Verification of rework is compliant with AXI Catalog of Visual

4.3.2 X-Ray Inspection for Hidden Connections Continuous Activity
product requirements Requirements/Criteria

Verification of rework is compliant with

4.3.3 ICT, Functional Test, etc., as dictated by process flow/routing Product Test Specification Continuous Activity
product requirements

Personnel Proficiency: All personnel involved in each of the processes listed here shall be proficient in the content, use and application of this process step. Objective evidence of that proficiency shall be
1.4
maintained and available for review. Objective evidence shall include records of training to the applicable job functions being performed, work experience, and/or results of periodic reviews of proficiency.
5.0 2.11 PROCESS PERSONNEL PROFICIENCY
Supervised on-the-job training is acceptable until proficiency is demonstrated. This applies to personnel proficiency on inspection tasks and mastering of the applicable standards such as manual visual
2.12
inspection, or automated inspection (i.e., AOI, AXI).

Customer/Supplier/Industry Approved
5.1 Training Material Used Internal Documentation Continuous Activity
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.2 On the job training learning curve Internal Documentation Continuous Activity
Training, Objective Evidence

Customer/Supplier/Industry Approved
5.3 Who are the instructors, (Engineers, Training Department, External) Internal Documentation Continuous Activity
Training, Objective Evidence
2.8
1.16 Instructor Proficiency (based on experience or training) on the Subject Customer/Supplier/Industry Approved
5.4 1.17 Internal Documentation Continuous Activity
Matter Training, Objective Evidence

5.5 Proficiency Demonstration Actual live demonstration Internal Documentation Continuous Activity

Documented, coordinated by Human

5.6 Technical Support Levels (Engineering, Technicians, Operator) Internal Documentation Continuous Activity
Resources

Internal Documentation or Industry

5.6.1 Technical Support Level - Knowledge Required Determined by the job requirements Continuous Activity
Driven

Per CQI-17, Section 1.6 Other Per ANSI/ESD S20.20 or IEC

6.0 3.9 ESD Equipment/Personnel Grounded Continuous Activity
Requirements 61340-5-3

Per CQI-17, Section 1.6 Other

7.0 2.1 - 2.3 Traceability Control - Rework Internal Documentation Continuous Activity
Requirements

Per CQI-17, Section 1.6 Other

8.0 2.7 PCB/PCA Handling - Loading/Unloading Internal Documentation Continuous Activity
Requirements
CQI-17
Special Process: Electronic Assembly Manufacturing-
Soldering System Assessment (EAM-SSA)
Version 2, August 2021

PROCESS TABLE O - Rework (Removal/Replacement and Touch-up)

All requirements given below are subordinate to customer specific requirements. Rework, Repair and Touch-up shall be As Agreed Between User and Supplier (AABUS).

The customer may have additional requirements, e.g., inspection testing, greater frequencies. When performing the job audit, the auditor shall verify Soldering Organization is conforming to customer requirements.

If score is less than 85% the audit considered "Not Satisfactory" Assessment Results 0%

Number of items checked 0 0 0 0

Related Needs
Control Control Frequency Not
Item # SSA Category/Process Steps N/A Satisfactory Immediate Auditor Notes
(How it's Done) (Where it's Documented) (How often it's Done) Satisfactory
Question Action

9.0 Other

Number of times PCA can be reworked, number of components/PCA, As long as Rework Process complies
9.1 Internal Documentation Continuous Activity
number of times same component? with the above requirements

PCA Touch up (repetitive and specific component) the root cause shall be
9.2 documented (i.e., design, material, process related) and short and long Per Documentation Internal Documentation Continuous Activity
term corrective action available for review.