Capabilities

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WellPCB is focusing on online prototype orders to meet the requirements for High Quality, Low Cost, Fast Delivery, Easy Ordering from customers around the world. We can accept 4 kinds of files format (Gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing.

We perform full DRC checks of all Client files and inform you immediately if we find any problem. We then will work with you to correct the files, so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

Rigid pcb

We can accept 4 kinds of files format (Gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing. We perform full DRC checks of all Client files and inform you immediately if we find any problem.

We then will work with you to correct the files, so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

  • Layer Counts
    1-64 layers
  • Lead Time
    Normal: 5-6 Days
    Expedited: 24-48Hours
  • Materials
    FR4, Metal Core, Arlon, Taconic, Nelco, Isola, Halogen Free, Rogers, PTFE, PI, etc.
  • Max. Copper
    1000um
  • Finished Board Thickness
    0.1 - 12 mm
  • Size of Finished Products(Max)
    22.5 * 47.2 inch
  • Size of Finished Products(Min)
    2 * 5mm
  • Min. Line/Track Width&Space of Inner Layer
    1.8/1.8 mil
  • Min. Line/Track Width&Space of Outer Layer
    2/2 mil
  • Buried / Blind Via (Non-cross)
    0.1 mil
  • Aspect ratio
    40 : 1
  • Min. Drilling Size(Mechanical)
    0.1 mm
  • Surface Treatment
    HASL, Lead free HASL, ENIG(+ G/F), Immersion silver/Tin, OSP, ENEPIG, bare copper.
  • Wrap and Twist
    ≤0.5%
  • Tolerance PTH/ Pressing fit hole /NPTH
    ±0.0762 mm /±0.05mm /±0.05mm
  • Drill tolerance
    ±2mil
  • BGA pitch
    8mil
  • Layer to layer registration
    ±3mil
  • Advanced Via & Hole Structures
    Blind/Buried Vias, Via-in-Via, Mechanically Crossed Blind Vias, Stacked Vias, Via-in-Pad
  • Impedance Control
    ±5Ω (
  • HDI
    18L any layer HDI (8+N+8 structure)
  • Qualifications
    ISO14001:2015, ISO9001:2015, ISO 13485:2016, IATF16949: 2016, Certified

pcb ASSEMBLY

We strive to make the whole assembly process as easy as possible:

Single Point Source: No need to order bare board PCB from one supplier, solder stencil from another supplier, and PCB assembly from yet another supplier.

We provide prototype promotions and also mass quantity production from one board to thousands of boards.

We offer a rapid turnaround, kit service, turnkey service, harness assembly, and box build service.

  • Placer Speed
    600,000 Chips/Hour
  • Lead Time
    25+ Days (To Be confirmed)
  • SMT
    SMT, Through Hole Assembly Single/Double-Side SMT, Single/Double-Sides Mixture Assembly
  • PCB Size
    50mm×50mm ~ 610mm×508mm
  • PCB Thickness
    0.5mm ~ 4.5mm
  • Min. Diameter / Space of BGA
    0.2mm / 0.35mm
  • Minimum Width / Space of QFP
    0.15mm/0.25mm
  • Qualifications
    ISO 9001: 2008
  • Accuracy
  • Reliability Test
    Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc.

FLEX pcb

Manufacturing Capability：Conventional Capability

Ultimate Capability：Unconventional ability；Submit to review beyond these Capabilities.

  • FPC Base Material(Adhesive)
    ShengyiSF302:PI=0.5 mil,1 mil,2 mil;Cu=0.5 oz,1 oz
    ShengyiSF305:PI=0.5 mil,1 mil,2 mil;Cu=0.33 oz,0.5 oz,1 oz
  • FPC Base Material(Adhesiveless)
    SongxiaRF-775/777:PI=1 mil,2 mil,3 mil;Cu=0.5 oz, 1 oz (Ultimate:PI=1 mil,2 mil,3 mil;Cu=2 oz)
    Xinyang:PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
    Taihong PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
    Dubang AP:PI=1 mil, 2 mil, 3 mil, 4 mil;Cu=0.5 oz, 1 oz (Ultimate:PI=1 mil，2 mil，3 mil，4 mil；Cu=2 oz)
  • Layers
    1-4 Layers (Ultimate:5-8 Layers)
  • Thickness of Finished Product (Flex Part，No Stiffener)
    0.05-0.5 mm (Ultimate:0.5-0.8 mm)
  • Size of Finished Products (Min)
    5 mm*10 mm (Bridgeless); 10 mm*10 mm (Bridge)
    Ultimate:4 mm*8 mm (Bridgeless); 8 mm*8 mm (Bridge)
  • Size of Finished Products (Max)
    9 inch*14 inch
    Ultimate:9 inch*23 inch (PI≥1 mil)
  • Impedance Tolerance
    Single-Ended：±5Ω(≤50Ω),±10%(＞50Ω)
    Ultimate:Single-Ended：±3Ω(≤50Ω)，±8%(＞50Ω)
  • Impedance Tolerance
    Differencial：±5Ω(≤50Ω),±10%(＞50Ω)
    Ultimate:Differencial：±4Ω(≤50Ω)，±8%(＞50Ω)
  • Tolerance of Finger Width
    ±0.1 mm (Ultimate:±0.05 mm)
  • Min Distance to the Edge of Finger
    8 mil (Ultimate:6 mil)
  • Min Distance between Pads
    4 mil (Ultimate:3 mil)
  • Minimum Laser Hole
    0.1mm
  • Minimum PTH
    0.3mm
  • Min NPTH Tolerance
    ±2 mil (Ultimate +0, -2 mil or +2 mil, -0)
  • Solder Bridge Min Width(Bottom Copper
    4 mil (Green), 8 mil
  • Solder Bridge Min Width(bottom copper 2-4OZ)
    6 mil, 8 mil
  • Overlay Colour
    White, Yellow (Printed Character: White)
  • Type of Surface Treatment
    OSP HASL, Lead Free HASL, Immersion Gold, Hard Gold, Immersion Silver, OSP
  • Selective Surface Treatment
    ENIG+OSP, ENIG+G/F

rigid-FLEX pcb

We serve our customers with strong technical R&D capability, various products, and stable and quick delivery capability. We are one of the competitive companies in the domestic with the high-class level in rigid-flex board fields.

Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

  • Feature
    Capability
  • Material
    Polyimide Flex+FR4
  • Solder Mask Color(Rigid Part)
    Green, Red, Yellow, Blue, White, Black, Matte Black, Matte Green, Matt Blue
  • Covrelay Color (Flex Part)
    Yellow Coverlay, Brownish Yellow
  • Silkscreen Color
    White, Black, yellow
  • Via Process
    Tenting Vias,Plugged Vias,Vias not Covered
  • Max Panel Size
    406mmx736mm
  • Min Panel Size
    10mm*15mm
  • Min. Track/Spacing
    3.5mil/ 4.0mil
  • Min. Hole Size
    0.15mm
  • Rigid-Flex Thickness
    0.2-4.0mm
  • Impedance Control Tolerance
    Single-ended：±3Ω(≤50Ω)，±5%(＞50Ω)
    Differential Pair：±3Ω(≤50Ω)，±5%(＞50Ω)
  • Twist & Warp min.
    0.75%（Symmetrical）
    1.5%（Symmetrical
  • Adhesive dispense width
    1.5±0.5mm（Slot Width≥10mm）
  • Min Distance Between R-F Connect Area to Conduct
    0.3mm（Half Depth Slot Process）
    0.5mm Normal
  • Min. Width of Resin Flow Out in R-F Connect Area
    0.5mm
    1.0mm Normal
  • Max inner Layer Finished Copper Thickness
    3oz
  • Min Mechanical Drill Size
    0.15mm （<=1.6mm）
    0.2mm (<=2.5mm）
  • Min Half-Hole (pth) Size
    0.3mm
  • Laser via Size
    4mil-6mil（Advance 6mil
  • Max buried Hole Size
    0.4mm
  • Max Drill Hole Size
    6.3mm
  • Max A/R for Through Hole
    12:1
  • Max A/R for Laser Blind Hole
    0.8:1
  • Outline Tolerance
    ±0.1mm

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3rd Floor, Nanhai Plaza, NO. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China

+86-311-86935221
+61-0417-264-974
[email protected]

Lot 12, Block 16, Phase IV, Cavite Economic Zone, Rosario, Cavite 4106, Philippines

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